是否Rohs认证: | 符合 | 生命周期: | Transferred |
包装说明: | TFBGA, | Reach Compliance Code: | compliant |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.09 |
JESD-30 代码: | S-PBGA-B36 | JESD-609代码: | e1 |
长度: | 3.5 mm | 湿度敏感等级: | 1 |
端子数量: | 36 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 座面最大高度: | 1.1 mm |
最大供电电压: | 1.98 V | 最小供电电压: | 1.62 V |
标称供电电压: | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 3.5 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR CIRCUIT | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
LM8323 | TI |
获取价格 |
LM8323 Mobile I/O Companion Supporting Keyscan, I/O Expansion, PWM, and ACCESS.bus Host In | |
LM8325-1 | TI |
获取价格 |
LM8325-1 Mobile I/O Companion Supporting Keyscan, I/O Expansion, PWM, and ACCESS.bus Host | |
LM8325-1GRA25A | TI |
获取价格 |
IC SPECIALTY CONSUMER CIRCUIT, PBGA25, MICRO ARRAY PACKAGE-25, Consumer IC:Other | |
LM8327 | TI |
获取价格 |
LM8327 Mobile I/O Companion Supporting Keyscan, I/O Expansion, PWM, and ACCESS.bus Host In | |
LM8327JGR8 | TI |
获取价格 |
LM8327 Mobile I/O Companion Supporting Keyscan, I/O Expansion, PWM, and ACCESS.bus Host In | |
LM8327JGR8X | TI |
获取价格 |
LM8327 Mobile I/O Companion Supporting Keyscan, I/O Expansion, PWM, and ACCESS.bus Host In | |
LM8328 | TI |
获取价格 |
LM8328 Mobile I/O Companion Supporting Keyscan, I/O Expansion, PWM, and ACCESS.bus Host In | |
LM8328TME | TI |
获取价格 |
LM8328 Mobile I/O Companion Supporting Keyscan, I/O Expansion, PWM, and ACCESS.bus Host In | |
LM8328TMX | TI |
获取价格 |
LM8328 Mobile I/O Companion Supporting Keyscan, I/O Expansion, PWM, and ACCESS.bus Host In | |
LM832M | NSC |
获取价格 |
LM832 Dynamic Noise Reduction System DNR |