LF-301A/K

更新时间： 2024-11-23 05:41:51

品牌	Logo	应用领域
罗姆 - ROHM		/
页数	文件大小	规格书
1页	680K
描述
Solder Profile and Pattern

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数据手册

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LF-301A/K 数据手册

Solder Profile and Pattern

1) Dip Types (LA, LB ,LAP,LBP series)

Please keep the preheat and peak temperatures with dip units as low as possible and the times as short as

is feasible, since the products are susceptible to heat during flow soldering. As a guide, ensure that the

internal temperature of the LED numeric display does not exceed 100°C.

Solder Pattern Example

Soldering Example

300

LA-301 series

A single wave is better than a double wave, while

3s or less

+0.1

stationary flow method is the best.

φ1.5 land shape

250

260°C or less

After soldering, immediately lower

the temperature of the substrate

200

+0.1

φ0.8 hole shape

150

Preheat 30s

or less

Other series

Conditions

General

flow conditions

100

+0.1

φ2.0 ₀land shape

+0.1

φ1.0 hole shape

Time (s)

100

120

140

Item

Conditions

Solder Temperature

Process Duration

30 seconds or less

3 seconds or less

Preheat temperature must

be no greater than 80°C.

Solder dip

At least 2mm from the base of the lead pin.

No more than 260°C.

No more than 300°C.

At least 2mm from the base of the lead pin.

Power: No more than 30W.

Solder iron

Reflow

3 seconds or less

Reflow cannot be used. (other than the LF-301 series)

Please use a resin-based flux, since flux that is acidic or highly alkaline could cause corrosion.

∗

2) Surface Mount Type (LF-301 series)

Please refer to the following reflow soldering profile and pattern examples for surface mount units.

Solder Pattern Example

Reflow Soldering Example

LF-301 A/K series

D: Peak Temperature

250

C: Heat Slope 2

200

B: Preheat

150

E: 200°C

+ range

100

A: Heat Slope 1

100

150

200

250

300

Time (s)

10-0.6

P=1.27

Type

A (Heat Slope 1)

B (Preheat)

C (Heat Slope 2)

D (Peak temperature, peak time)

E (200°C + range)

140 to 160°C

LF-301A/K series

4°C/s max

4°C/s max.

250°C max, 5s max.

50s max.

(1 min. or less)

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