Datasheet > LE87411NQC

LE87411NQC

更新时间： 2024-02-23 14:07:47

品牌	Logo	应用领域
美国微芯 - MICROCHIP		驱动接口集成电路
页数	文件大小	规格书
10页	577K
描述
Line Driver, 2 Func, 2 Driver

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技术参数
数据手册

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LE87411NQC 技术参数

生命周期：	Active	包装说明：	HVQCCN,
Reach Compliance Code：	compliant	Factory Lead Time：	10 weeks
风险等级：	5.51	差分输出：	NO
驱动器位数：	2	输入特性：	STANDARD
接口集成电路类型：	LINE DRIVER	接口标准：	GENERAL PURPOSE
JESD-30 代码：	S-XQCC-N16	长度：	4 mm
功能数量：	2	端子数量：	16
最高工作温度：	85 °C	最低工作温度：
封装主体材料：	UNSPECIFIED	封装代码：	HVQCCN
封装形状：	SQUARE	封装形式：	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
座面最大高度：	1 mm	最大供电电压：	12.6 V
最小供电电压：	11.4 V	标称供电电压：	12 V
表面贴装：	YES	温度等级：	OTHER
端子形式：	NO LEAD	端子节距：	0.65 mm
端子位置：	QUAD	宽度：	4 mm
Base Number Matches：	1

LE87411NQC 数据手册

Le87411

PLC Single Channel Line Driver

Line Driver BD870 Series

Preliminary Data Sheet

Document ID# 149136

Version 2

June 2014

FEATURES

ORDERING INFORMATION

•

16-pin, 4x4 mm QFN Package

Very low power dissipation

Class AB operation

Le87411NQC

Le87411NQCT

16-pin QFN Green Package

Tray

Tape and Reel

–

•

5 programmable states

No external gain resistors required

RoHS compliant

The green package meets RoHS 2 Directive 2011/65/EU of the

European Council to minimize the environmental impact of electrical

equipment.

APPLICATIONS

BLOCK DIAGRAM

•

Power Line Communications

Home Networking

HPNA

Mode

Control

G.HN

GND

DESCRIPTION

VINA

–

VOUTA

The Le87411 is a single channel differential amplifier

designed to work in Home Plug Alliance HPAV2

systems with very low power dissipation.

GND

The Le87411 contains a pair of wideband amplifiers

designed with Microsemi’s HV15 Bipolar SOI process

for low power consumption.

The line driver gain is fixed internally. The amplifiers are

powered from a single supply.

The device can be programmed to one-of-three preset

Bias levels or to impedance controlled Disable or

Standby states. The control pins respond to input levels

that can be generated with a standard tri-state GPIO.

GND

–

VOUTB

VINB

GND

The Le87411 is available in a 16-pin (4 mm x 4 mm)

QFN package with exposed pad for enhanced thermal

conductivity.

Microsemi Corporation Confidential and Proprietary

12 3 4 5 6 7...10

中文翻译

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