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LB-20 PDF预览

LB-20

更新时间: 2024-11-12 22:31:35
品牌 Logo 应用领域
其他 - ETC /
页数 文件大小 规格书
1页 72K
描述
Effect of PWB Copper Area on Thermal Performance of 20−Lead SOIC LB Package

LB-20 数据手册

  
Effect of PWB Copper Area on Thermal Performance  
of 20Lead SOIC LB Package  
Thermal Resistance (RθJA) vs. Copper Area on PWB  
100  
One side Copper  
Two side Copper  
90  
80  
70  
60  
50  
40  
0
1
2
3
4
Area of Copper on Board (in2)  
Variable Copper Area Test Board  
Copper Area Must Be Connected to  
Package Ground Leads  
Red-hatched area is copper on the surface of the PWB  
The 20 lead LB package has 4 ground  
leads as shown. Additional copper  
area must be connected to these  
leads.  
16 15  
5
6
Using a Double-Layer PWB  
For the double-layer copper board, the  
copper area on the bottom is identical  
to the area on the top. Both the top and  
bottom layers are thermally connected  
through vias placed on each ground  
lead.  

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