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LA407B3B PDF预览

LA407B3B

更新时间: 2024-10-28 03:50:15
品牌 Logo 应用领域
西迪斯 - CTS 半导体
页数 文件大小 规格书
2页 221K
描述
METAL CASE, CASE-MOUNTED SEMICONDUCTORS

LA407B3B 数据手册

 浏览型号LA407B3B的Datasheet PDF文件第2页 
Series LA-B3  
Technical  
METAL CASE, CASE-MOUNTED  
SEMICONDUCTORS  
Part Number Series LA-B3  
Natural Conv. (°C/W): 12  
Forced Air (°C/W): 3.7  
Mounting Envelope: 1.63" x 1.29" x .75"  
DESCRIPTION OF CURVES  
A.  
B.  
N.C. Horiz. Device Only  
Mounted to G-10.  
N.C Horiz. & Vert. With  
Dissipator.  
C.  
D.  
E.  
200 FPM w/Diss.  
500 FPM w/Diss.  
1000 FPM w/Diss.  
Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound.  
Derate 0.7 °C/watt for unplated part in natural convection only.  

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