是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | DIP | 包装说明: | DIP, |
针数: | 28 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.41 |
风险等级: | 5.92 | Is Samacsys: | N |
最长访问时间: | 12 ns | 其他特性: | AUTOMATIC POWER-DOWN; FLASH CLEAR |
JESD-30 代码: | R-GDIP-T28 | 长度: | 36.83 mm |
内存密度: | 65536 bit | 内存集成电路类型: | STANDARD SRAM |
内存宽度: | 8 | 湿度敏感等级: | 3 |
功能数量: | 1 | 端口数量: | 1 |
端子数量: | 28 | 字数: | 8192 words |
字数代码: | 8000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 8KX8 | 输出特性: | 3-STATE |
可输出: | YES | 封装主体材料: | CERAMIC, GLASS-SEALED |
封装代码: | DIP | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 并行/串行: | PARALLEL |
认证状态: | Not Qualified | 座面最大高度: | 5.08 mm |
最小待机电流: | 2 V | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
宽度: | 7.62 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
L7C186CM15 | LOGIC |
获取价格 |
Standard SRAM, 8KX8, 15ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28 | |
L7C186CM20 | LOGIC |
获取价格 |
Standard SRAM, 8KX8, 20ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28 | |
L7C186CM35 | LOGIC |
获取价格 |
Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28 | |
L7C186CME20 | LOGIC |
获取价格 |
Standard SRAM, 8KX8, 20ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28 | |
L7C186CME35 | LOGIC |
获取价格 |
Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28 | |
L7C186DC12 | LOGIC |
获取价格 |
Standard SRAM, 8KX8, 12ns, CMOS, CDIP28, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-28 | |
L7C186DM15 | LOGIC |
获取价格 |
Standard SRAM, 8KX8, 15ns, CMOS, CDIP28, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-28 | |
L7C186DM20 | LOGIC |
获取价格 |
Standard SRAM, 8KX8, 20ns, CMOS, CDIP28, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-28 | |
L7C186DM25 | LOGIC |
获取价格 |
Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-28 | |
L7C186DM35 | LOGIC |
获取价格 |
Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-28 |