IDC Low Inductance Capacitors (SnPb)
IDC (InterDigitated Capacitors) 0306/0612/0508
GENERAL DESCRIPTION
Inter-Digitated Capacitors (IDCs) are used for both semiconductor package and
board level decoupling. The equivalent series inductance (ESL) of a single capacitor
or an array of capacitors in parallel determines the response time of a Power
Delivery Network (PDN). The lower the ESL of a PDN, the faster the response time. A
designer can use many standard MLCCs in parallel to reduce ESL or a low ESL Inter-
Digitated Capacitor (IDC) device. These IDC devices are available in versions with a
maximum height of 0.95mm or 0.55mm.
0612
+
–
+
–
IDCs are typically used on packages of semiconductor products with power levels
of 15 watts or greater. Inter-Digitated Capacitors are used on CPU, GPU, ASIC, and
ASSP devices produced on 0.13μ, 90nm, 65nm, and 45nm processes. IDC devices
are used on both ceramic and organic package substrates. These low ESL surface
mount capacitors can be placed on the bottom side or the top side of a package
substrate. The low profile 0.55mm maximum height IDCs can easily be used on the
bottom side of BGA packages or on the die side of packages under a heat spreader.
0508
+
–
+
–
0306
IDCs are used for board level decoupling of systems with speeds of 300MHz or
greater. Low ESL IDCs free up valuable board space by reducing the number of
capacitors required versus standard MLCCs. There are additional benefits to
reducing the number of capacitors beyond saving board space including higher
reliability from a reduction in the number of components and lower placement costs
based on the need for fewer capacitors.
TYPICAL IMPEDANCE
10
The Inter-Digitated Capacitor (IDC) technology was developed by KYOCERA AVX.
This is the second family of Low Inductance MLCC products created by KYOCERA
AVX. IDCs are a cost effective alternative to KYOCERA AVX’s first generation low ESL
family for high-reliability applications known as LICA (Low Inductance Chip Array).
MLCC_1206
LICC_0612
1
0.1
IDC_0612
KYOCERA AVX IDC products are available with a lead termination for high reliability
military and aerospace applications that must avoid tin whisker reliability issues.
0.01
0.001
1
10
100
1000
Frequency (MHz)
HOW TO ORDER
L
3
L
1
6
D
225
M
A
B
3
A
Style IDC Case
Low
Number of Voltage Dielectric Capacitance Capacitance Failure Termination Packaging
Thickness
Max. Thickness
mm (in)
A=Standard
S=0.55 (0.022)
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
C = X7R
D = X5R
Z = X7S
B =5% min.
Lead
Available
1=7" Reel
3=13" Reel
Size
Inductance Terminals
Code (In pF)
2 Sig. Digits +
Number of
Zeros
Tolerance
Rate
2 = 0508
3 = 0612
4 = 0306
1 = 8 Termi-
nals
M = ±20%
A = N/A
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
PERFORMANCE CHARACTERISTICS
Capacitance Tolerance ±20% Preferred
No problems observed after 2.5 x RVDC for
5 seconds at 50mA max current
Dissipation Factor
X7R = -55°C to +125°C
X5R = -55°C to +85°C
X7S = -55°C to +125°C
Operation
CTE (ppm/C)
12.0
Temperature Range
Thermal Conductivity
4-5W/M K
Temperature
Coefficient
Voltage Ratings
±15% (0VDC), ±22% (X7S)
Terminations
Available
Plated Nickel and Solder
4, 6.3, 10, 16, 25 VDC
≤ 6.3V = 6.5% max;
10V = 5.0% max;
≥ 16V = 3.5% max
Dissipation Factor
Insulation Resistance
(@+25°C, RVDC)
100,000MΩ min, or 1,000MΩ per μF
min.,whichever is less
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
86
012820
surface mount ceramic capacitor products
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