Datasheet > L1GN70G473KA10

L1GN70G473KA10

更新时间： 2024-11-06 14:54:03

品牌	Logo	应用领域
基美 - KEMET		/
页数	文件大小	规格书
10页	542K
描述
KPS-MCL Indust C0G HT200C, Ceramic, 0.047 uF, 10%, 2000 VDC, C0G

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L1GN70G473KA10 数据手册

Surface Mount and Through-Hole Multilayer Ceramic Capacitors

KPS-MCL Low-Loss High Temperature 200°C SMPS Stacks,

200 – 2,000 VDC (Industrial Grade)

Overview

KEMET Power Solutions - Low loss (KPS MCL) High

Temperature SMPS Ceramic Stacked Capacitors combine

a robust and proprietary C0G/NPO base metal electrode

(BME) dielectric system with a durable lead-frame

technology for high temperature and high power SMPS

applications. These devices are speciﬁcally designed to

withstand the demands of harsh industrial environments

such as down-hole oil exploration and automotive/avionics

engine compartment circuitry.

Mechanically isolating the capacitors from the PCB improves

mechanical and thermal stress performance, while the

parallel circuit conﬁguration allows for bulk capacitance in

the same or smaller design footprint.

KEMET’s high temperature C0G capacitors are temperature-

compensating and are well suited for resonant circuit

applications, or for those where Q and stability of

capacitance characteristics are required. They exhibit no

change in capacitance with respect to time and voltage, and

boast a negligible change in capacitance with reference to

ambient temperature. Capacitance change is limited to ±30

ppm/ºC from −55°C to +200°C. In addition, these capacitors

exhibit high insulation resistance with low dissipation factor

at elevated temperatures up to +200°C. They also exhibit

low ESR at high frequencies and offer greater volumetric

eﬃciency over competitive high temperature BME ceramic

capacitor devices.

The KPS-MCL is constructed with large chip multilayer

ceramic capacitors (MLCCs), vertically stacked and

secured to a lead-frame termination system, using a high

melting point (HMP) solder alloy. Vertically stacking the

capacitors in lead frames allows for much lower ESR (low

loss) and thermal resistance, which translates to very

high ripple current capability. The lead-frame isolates

the MLCCs from the printed circuit board (PCB), while

establishing a parallel circuit conﬁguration.

Beneﬁts

• Low-Loss

• Low ESR and ESL

• High thermal stability

• High ripple current capability

• Straight Pin lead wires for "through-hole" mounting

• Formed "J" and "L" lead wires for surface mounting

• Operating temperature range of −55°C to +200°C

• Case Codes (Case Sizes) – 69 (2220) and 70 (2225)

• DC voltage ratings of 200 – 2,000 V

• Capacitance offerings ranging from 11 nF – 1.2 µF

• Industrial grade

• High frequency performance and bulk capacitance in

a reduced footprint

Built Into Tomorrow

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1102_KPS-MCL_200C_STACKS • 8/22/2023

12 3 4 5 6 7...10

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