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L1GN70D903KA05 PDF预览

L1GN70D903KA05

更新时间: 2024-12-02 14:54:03
品牌 Logo 应用领域
基美 - KEMET /
页数 文件大小 规格书
10页 542K
描述
KPS-MCL Indust C0G HT200C, Ceramic, 0.09 uF, 10%, 1000 VDC, C0G

L1GN70D903KA05 数据手册

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Surface Mount and Through-Hole Multilayer Ceramic Capacitors  
KPS-MCL Low-Loss High Temperature 200°C SMPS Stacks,  
200 – 2,000 VDC (Industrial Grade)  
Overview  
KEMET Power Solutions - Low loss (KPS MCL) High  
Temperature SMPS Ceramic Stacked Capacitors combine  
a robust and proprietary C0G/NPO base metal electrode  
(BME) dielectric system with a durable lead-frame  
technology for high temperature and high power SMPS  
applications. These devices are specifically designed to  
withstand the demands of harsh industrial environments  
such as down-hole oil exploration and automotive/avionics  
engine compartment circuitry.  
Mechanically isolating the capacitors from the PCB improves  
mechanical and thermal stress performance, while the  
parallel circuit configuration allows for bulk capacitance in  
the same or smaller design footprint.  
KEMET’s high temperature C0G capacitors are temperature-  
compensating and are well suited for resonant circuit  
applications, or for those where Q and stability of  
capacitance characteristics are required. They exhibit no  
change in capacitance with respect to time and voltage, and  
boast a negligible change in capacitance with reference to  
ambient temperature. Capacitance change is limited to ±30  
ppm/ºC from −55°C to +200°C. In addition, these capacitors  
exhibit high insulation resistance with low dissipation factor  
at elevated temperatures up to +200°C. They also exhibit  
low ESR at high frequencies and offer greater volumetric  
efficiency over competitive high temperature BME ceramic  
capacitor devices.  
The KPS-MCL is constructed with large chip multilayer  
ceramic capacitors (MLCCs), vertically stacked and  
secured to a lead-frame termination system, using a high  
melting point (HMP) solder alloy. Vertically stacking the  
capacitors in lead frames allows for much lower ESR (low  
loss) and thermal resistance, which translates to very  
high ripple current capability. The lead-frame isolates  
the MLCCs from the printed circuit board (PCB), while  
establishing a parallel circuit configuration.  
Benefits  
• Low-Loss  
• Low ESR and ESL  
• High thermal stability  
• High ripple current capability  
• Straight Pin lead wires for "through-hole" mounting  
• Formed "J" and "L" lead wires for surface mounting  
• Operating temperature range of −55°C to +200°C  
• Case Codes (Case Sizes) – 69 (2220) and 70 (2225)  
• DC voltage ratings of 200 – 2,000 V  
• Capacitance offerings ranging from 11 nF – 1.2 µF  
• Industrial grade  
• High frequency performance and bulk capacitance in  
a reduced footprint  
Built Into Tomorrow  
© KEMET Electronics Corporation • One East Broward Boulevard  
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com  
C1102_KPS-MCL_200C_STACKS • 8/22/2023  
1

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