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KXPC8250ACZUMHBA PDF预览

KXPC8250ACZUMHBA

更新时间: 2024-10-30 14:51:59
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 外围集成电路
页数 文件大小 规格书
60页 433K
描述
RISC Microprocessor, 32-Bit, 266MHz, CMOS, PBGA480, TBGA-480

KXPC8250ACZUMHBA 技术参数

是否Rohs认证:不符合生命周期:Obsolete
包装说明:TBGA-480Reach Compliance Code:unknown
风险等级:5.92Is Samacsys:N
其他特性:REQUIRES 3.3V SUPPLY FOR I/O地址总线宽度:32
位大小:32边界扫描:YES
外部数据总线宽度:64格式:FIXED POINT
集成缓存:YESJESD-30 代码:S-PBGA-B480
JESD-609代码:e0长度:37.5 mm
端子数量:480最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装等效代码:BGA480,29X29,50
封装形状:SQUARE封装形式:GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度):NOT SPECIFIED电源:1.7/2.1,3.3 V
认证状态:Not Qualified座面最大高度:1.65 mm
速度:266 MHz子类别:Microprocessors
最大供电电压:2.1 V最小供电电压:1.9 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:37.5 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC
Base Number Matches:1

KXPC8250ACZUMHBA 数据手册

 浏览型号KXPC8250ACZUMHBA的Datasheet PDF文件第2页浏览型号KXPC8250ACZUMHBA的Datasheet PDF文件第3页浏览型号KXPC8250ACZUMHBA的Datasheet PDF文件第4页浏览型号KXPC8250ACZUMHBA的Datasheet PDF文件第5页浏览型号KXPC8250ACZUMHBA的Datasheet PDF文件第6页浏览型号KXPC8250ACZUMHBA的Datasheet PDF文件第7页 
Advance Information  
MPC8250EC/D  
Rev.0.8 11/2002  
MPC8250  
Hardware Specications  
This document contains detailed information on power considerations, DC/AC electrical  
characteristics, and AC timing specifications for the MPC8250 PowerQUICC II™  
communications processor.  
The following topics are addressed:  
Topic  
Page  
2
Section 1.1, “Features”  
Section 1.2, “Electrical and Thermal Characteristics”  
Section 1.2.1, “DC Electrical Characteristics”  
Section 1.2.2, “Thermal Characteristics”  
Section 1.2.3, “Power Considerations”  
Section 1.2.4, “AC Electrical Characteristics”  
Section 1.3, “Clock Configuration Modes”  
Section 1.3.1, “Local Bus Mode”  
Section 1.3.2, “PCI Mode”  
5
5
10  
10  
11  
17  
17  
21  
27  
53  
56  
Section 1.4, “Pinout”  
Section 1.5, “Package Description”  
Section 1.6, “Ordering Information”  
The MPC8250 is available in two packages—the standard ZU package (480 TBGA) and an  
alternate VR package (516 PBGA)—as described in Section 1.4, “Pinout,” and Section 1.5,  
“Package Description.” For more information on VR packages, contact your Motorola sales  
office. Note that throughout this document references to the MPC8250 are inclusive of its VR  
version unless otherwise specified.  
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE  

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