Datasheet > KMB225S

KMB225S

更新时间： 2024-11-26 01:17:55

品牌	Logo	应用领域
迪一电子 - DYELEC		二极管
页数	文件大小	规格书
2页	1178K
描述
Ideally Suited for Automatic Assembly

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中文翻译

获取价格

数据手册

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KMB225S 数据手册

KMB22S THRU KMB225S

SCHOTTKY

SINGLE PHASE

AMP SURFACE MOUNT

BRIDGE RECTIFIER

2.0

Features

Schottky Brrier Chip

MBS

Low Power Loss,High Efficiency

Ideally Suited for Automatic Assembly

Surge Overload Rating to 50A Peak

Plastic Case Material has UL Flammability

0.195(4.95)

0.177(4.5)

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Rating

0.028(0.7)

0.020(0.5)

Mechanical Data

㾦

· Case: MB-S, molded plastic

· Terminals: plated leads solderable per

MIL-STD-202, Method 208

0.106(2.7)

0.090(2.3)

0.067(1.7)

0.161(4.1)

0.142(3.6)

· Polarity: as marked on case

0.043(1.1)

· Mounting position: Any

0.023(0.6)

· Marking: type number

· Lead Free: For RoHS / Lead Free Version,

dimensions in inches and (millimeters)

Maximum Ratings and Electrical Characteristics ^@T_A^{=25°C unless otherwise specified}

Single Phase, half wave, 60Hz, resistive or inductive load.

For capacitive load, derate current by 20%.

KMB KMB

215S 220S 225S

210S

KMB

28S

KMB KMB

25S 26S

KMB KMB KMB KMB

22S 23S 24S 245S

SYMBOL

UNITS

TYPE NUMBER

50 60 80

V^RRM

V^R(RMS)

V^DC

20 30

14 21

20 30

100 150 200 250

Peak Repetitive Reverse Voltage

RMS Reverse Voltage

DC Blocking Voltage

40 45

28 31

40 45

35 42

105 140 175

150 200 250

100

Average Rectified Output Current ( Note1) @T = 90°C

I^O

2.0

Non-Repetitive Peak Forward Surge Current 8.3ms

Single half sine-wave superimposed on rated load

(JEDEC Method)

FSM

I²t Rating for Fusing (t < 8.3ms)

²t

²s

10.375

0.7

0.90

0.05

0.92

Forward Voltage per element

@I_F=2.0A

VFM

0.85

0.55

0.1

Peak Reverse Current

At Rated DC Blocking Voltage

@T_A= 25°C

@T_A= 100°C

I_RM

Typical Junction Capacitance per leg

Typical Thermal Resistance per leg

°C/W

( Note2)

R^ꢀ^JA

Operating junction temperature range

T^J

-55 to +150

°C

T_STG

Operating and Storage Temperature Range

Note:

1. Mounted on aluminum substrate PC board with 1.3mm solder pad.

2. Thermal REsistance From Junction to Ambient

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