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KMB12F_V01 PDF预览

KMB12F_V01

更新时间: 2024-11-22 02:51:27
品牌 Logo 应用领域
钜兴 - JUXING /
页数 文件大小 规格书
2页 1724K
描述
Surface Mount Schottky Bridge Rectifiers

KMB12F_V01 数据手册

 浏览型号KMB12F_V01的Datasheet PDF文件第2页 
KMB12F THRU KMB125F  
Surface Mount Schottky Bridge Rectifiers  
MBF(GW)  
Features  
Schottky Brrier Chip  
·
·
·
Low Power Loss,High Efficiency  
Ideally Suited for Automatic Assembly  
Surge Overload Rating to 30A Peak  
Plastic Case Material has UL Flammability  
·
·
ꢀ ꢀ ꢀClassificationꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ 94V-0ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
Rating  
Mechanical Data  
· Case: MB-F, molded plastic  
· Terminals: plated leads solderable per  
MIL-STD-202, Method 208  
· Polarity: as marked on case  
· Mounting position: Any  
· Marking: type number  
· Lead Free: For RoHS / Lead Free Version,  
Maximum Ratings and Electrical Characteristics @TA=25°C unless otherwise specified  
Single Phase, half wave, 60Hz, resistive or inductive load.  
For capacitive load, derate current by 20%.  
KMB KMB  
KMB KMB KMB KMB KMB  
KMB  
16F  
SYMBOL  
UNITS  
TYPE NUMBER  
18F  
115F 120F 125F  
12F  
14F  
110F  
60  
42  
60  
80  
56  
80  
20  
14  
20  
100  
70  
100  
150 200 250  
105 140 175  
150 200 250  
Peak Repetitive Reverse Voltage  
RMS Reverse Voltage  
DC Blocking Voltage  
VRRM  
VR(RMS)  
VDC  
40  
28  
40  
V
A
A
Average Rectified Output Current ( Note1) @T = 90°C  
IO  
1.0  
A
Non-Repetitive Peak Forward Surge Current 8.3ms  
Single half sine-wave superimposed on rated load  
(JEDEC Method)  
I
FSM  
30  
I2t Rating for Fusing (t < 8.3ms)  
2s  
A
I
2 t  
5.0  
Forward Voltage per element  
@IF =1.0AV  
0.55  
0.7  
0.95  
0.98  
0.85  
VFM  
V
0.05  
5
0.1  
10  
Peak Reverse Current  
At Rated DC Blocking Voltage  
@TA = 25°C  
@TA = 100°C  
IRM  
mA  
28  
75  
pF  
j
Typical Junction Capacitance per leg  
Typical Thermal Resistance per leg  
C
°C/W  
( Note2)  
RJA  
°C  
°C  
Operating junction temperature range  
T
J
-55 to +150  
-55 to +150  
Operating and Storage Temperature Range  
TSTG  
Note:  
2
1. Mounted on aluminum substrate PC board with 1.3mm solder pad.  
2. Thermal REsistance From Junction to Ambient  
http://www.trr-jx.com  
version: 02  

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