Datasheet > KMB12S

KMB12S

更新时间： 2024-10-29 01:18:03

品牌	Logo	应用领域
迪一电子 - DYELEC		/
页数	文件大小	规格书
2页	1126K
描述
SINGLE PHASE 1.0 AMP SURFACE MOUNT SCHOTTKY BRIDGE RECTIFIER

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中文翻译

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数据手册

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KMB12S 数据手册

KMB12S THRU KMB125S

SCHOTTKY

SINGLE PHASE 1.0 AMP SURFACE MOUNT

BRIDGE RECTIFIER

Features

Schottky Brrier Chip

MBS

Low Power Loss,High Efficiency

Ideally Suited for Automatic Assembly

Surge Overload Rating to 30A Peak

Plastic Case Material has UL Flammability

0.195(4.95)

0.177(4.5)

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Rating

0.028(0.7)

0.020(0.5)

Mechanical Data

㾦

· Case: MB-S, molded plastic

· Terminals: plated leads solderable per

MIL-STD-202, Method 208

0.106(2.7)

0.090(2.3)

0.067(1.7)

· Polarity: as marked on case

0.161(4.1)

0.142(3.6)

0.043(1.1)

· Mounting position: Any

0.023(0.6)

· Marking: type number

· Lead Free: For RoHS / Lead Free Version,

dimensions in inches and (millimeters)

Maximum Ratings and Electrical Characteristics ^@T_A^{=25°C unless otherwise specified}

Single Phase, half wave, 60Hz, resistive or inductive load.

For capacitive load, derate current by 20%.

KMB KMB KMB KMB KMB KMBKMB KMB KMB KMB KMB

SYMBOL

UNITS

TYPE NUMBER

18S

115S 120S 125S

110S

15S 16S

12S 13S 14S 145S

50 60 80

35 42 56

50 60 80

20 30

14 21

20 30

100 150 200 250

Peak Repetitive Reverse Voltage

RMS Reverse Voltage

DC Blocking Voltage

V^RRM

V^R(RMS)

V^DC

40 45

28 31

40 45

105 140 175

150 200 250

100

Average Rectified Output Current ( Note1) @T = 90°C

I^O

1.0

Non-Repetitive Peak Forward Surge Current 8.3ms

Single half sine-wave superimposed on rated load

(JEDEC Method)

FSM

I²t Rating for Fusing (t < 8.3ms)

²s

²t

3.735

Forward Voltage per element

@I_F=1.0AV

0.55

0.7

0.90

0.05

0.92

0.85

VFM

0.1

Peak Reverse Current

At Rated DC Blocking Voltage

@T_A= 25°C

@T_A= 100°C

I^RM

Typical Junction Capacitance per leg

Typical Thermal Resistance per leg

°C/W

( Note2)

R^ꢀ^JA

°C

Operating junction temperature range

T^J

-55 to +150

Operating and Storage Temperature Range

T_STG

Note:

1. Mounted on aluminum substrate PC board with 1.3mm solder pad.

2. Thermal REsistance From Junction to Ambient

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