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KM110BH/2470 PDF预览

KM110BH/2470

更新时间: 2024-10-28 20:02:35
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
12页 74K
描述
IC SPECIALTY ANALOG CIRCUIT, SMA3, Analog IC:Other

KM110BH/2470 技术参数

生命周期:Obsolete包装说明:,
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.6模拟集成电路 - 其他类型:ANALOG CIRCUIT
JESD-30 代码:R-XSMA-T3功能数量:1
端子数量:3最高工作温度:125 °C
最低工作温度:-40 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
认证状态:Not Qualified最大供电电压 (Vsup):16 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:NO温度等级:AUTOMOTIVE
端子形式:THROUGH-HOLE端子位置:SINGLE
Base Number Matches:1

KM110BH/2470 数据手册

 浏览型号KM110BH/2470的Datasheet PDF文件第5页浏览型号KM110BH/2470的Datasheet PDF文件第6页浏览型号KM110BH/2470的Datasheet PDF文件第7页浏览型号KM110BH/2470的Datasheet PDF文件第9页浏览型号KM110BH/2470的Datasheet PDF文件第10页浏览型号KM110BH/2470的Datasheet PDF文件第11页 
Philips Semiconductors  
Product specification  
KM110BH/2430;  
KM110BH/2470  
30° and 70° angle sensor hybrids  
APPLICATION INFORMATION  
The sensor hybrids KM110BH/2430 and KM110BH/2470  
are available with different electrical contacts:  
V
handbook, halfpage  
O
V
O
V
SENSOR  
1. Stretched pins with a pitch of 2.54 mm; these pins are  
recommended for connector and/or cable connections  
(see Fig.9).  
CC  
R
L
2. Double ’s’ bent pins (see Fig.10) with a pitch of  
5.71 mm; bent pins are recommended for rigid  
soldered connections to compensate for mechanical  
stress. Quote type numbers KM110BH/2430G and  
KM110BH/2470G respectively for these hybrids.  
MBD834  
GND  
Fig.8 Application circuit.  
1998 Mar 26  
8

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