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KFG1216U2A-FIB50 PDF预览

KFG1216U2A-FIB50

更新时间: 2024-01-26 01:43:14
品牌 Logo 应用领域
三星 - SAMSUNG /
页数 文件大小 规格书
114页 1204K
描述
Flash, 32MX16, 76ns, PBGA63, 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, FBGA-63

KFG1216U2A-FIB50 数据手册

 浏览型号KFG1216U2A-FIB50的Datasheet PDF文件第3页浏览型号KFG1216U2A-FIB50的Datasheet PDF文件第4页浏览型号KFG1216U2A-FIB50的Datasheet PDF文件第5页浏览型号KFG1216U2A-FIB50的Datasheet PDF文件第7页浏览型号KFG1216U2A-FIB50的Datasheet PDF文件第8页浏览型号KFG1216U2A-FIB50的Datasheet PDF文件第9页 
OneNAND512(KFG1216x2A-xxB5)  
1.4 Architectural Benefits  
FLASH MEMORY  
OneNAND is a highly integrated non-volatile memory solution based around a NAND Flash memory array.  
The chip integrates system features including:  
xꢀꢀꢀA BootRAM and bootloader  
xꢀꢀꢀTwo independent bi-directional 2KB DataRAM buffers  
xꢀꢀꢀA High-Speed x16 Host Interface  
xꢀꢀꢀOn-chip Error Correction  
xꢀꢀꢀOn-chip NOR interface controller  
This on-chip integration enables system designers to reduce external system logic and use high-density NAND Flash in applications  
that would otherwise have to use more NOR components.  
OneNAND takes advantage of the higher performance NAND program time, low power, and high density and combines it with the  
synchronous read performance of NOR. The NOR Flash host interface makes OneNAND an ideal solution for applications like G3  
Smart Phones, Camera Phones, and mobile applications that have large, advanced multimedia applications and operating systems,  
but lack a NAND controller.  
When integrated into a Samsung Multi-Chip-Package with Samsung Mobile DDR SDRAM, designers can complete a high-perfor-  
mance, small footprint solution.  
The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right  
to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have  
any questions, please contact the SAMSUNG branch office near you.  
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