DATA SHEET
SEMICONDUCTOR
KBPC25005N THRU KBPC2510N
VOLTAGE RANGE 50 to 1000 Volts
CURRENT 25 Ampere
BR35N Unit: inch(mm)
FEATURES
‧ Low cost
‧ This series is UL recognized under component
index, file number E127707
‧ High forward surge current capability
‧ Integrally molded heatsink provide
very low thermal resistance.
‧ High isolation voltage from case to lugs.
‧ High temperature soldering guaranteed:
260℃/10 second, at 5 lbs. (2.3kg) tension.
‧ High temperature soldering : 260OC / 10 seconds at terminals
‧ Pb free product at available : 99% Sn above meet RoHS
environment substance directive request
MECHANICAL DATA
‧ Case: Molded plastic body, suffic "N" for thinner type
‧ Terminal: Plated 0.25" (6.35mm) lug.
‧ Polarity: Polarity symbols marked on case.
‧ Mounting: Thru hole for #10 screw, 20 in,- lbs. Torqute Max.
‧ Weight: 0.55 ounce, 15.6gram(KBPC25N)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
‧ Ratings at 25℃ ambient temperature unless otherwise specified
‧ Single phase, half wave, 60Hz, resistive or inductive load.
‧ For capacitive load derate current by 20%
KBPC KBPC KBPC KBPC KBPC KBPC KBPC
SYMBOLS
UNIT
25005N 2501N 2502N 2504N 2506N 2508N 2510N
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
VRRM
50
35
50
100
70
200
140
200
400
280
400
600
420
600
800
560
800
1000 Volts
700 Volts
VRMS
VDC
Maximum DC Blocking Voltage
100
1000 Volts
Amps
Maximum Average Forward Rectified Output
Current, at TC = 50_ (Note 1, 2)
I(AV)
IFSM
25
Peak Forward Surge Current
8.3ms single half sine - wave superimposed on
rated load (JEDEC method )
300
Amps
Rating for Fusing (t<8.3ms)
I2t
373
1.1
10
A2s
Volts
μA
Maximum Instantaneous Forward Voltage Drop
per bridge element at 12.5A
VF
TA = 25℃
TA =100℃
Maximum DC Reverse Current at rate
DC blocking voltage per element
IR
1.0
2500
mA
VAC
℃/W
Isolation Voltage from case to lugs
Typical Thermal Resistance (Note 1,2)
Operating Temperature Range
Storage Temperature Range
VISO
RθJC
TJ
2.0
(-65 to +150)
(-65 to +150)
℃
TSTG
1. Unit mounted on 5" X 6" X 4.9" (12.8cm X 15.2cm X 12.4cm)Al. finned Plate.
2. Bolt down on heat-sink with silicon thermal compound between bridge and mounting sutfae for maximum heat
transfer efficiency with # 10 screw.
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1
REV.02 20120305