WTE
PO WER SEMICONDUCTORS
KBPC1000GS – KBPC1010GS
10A GLASS PASSIVATED IN-LINE BRIDGE RECTIFIER
Features
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Glass Passivated Die Construction
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Low Forward Voltage Drop
High Current Capability
High Reliability
High Surge Current Capability
Ideal for Printed Circuit Boards
Designed for Saving Mounting Space
A
KBPC-S
Min
Dim
A
Max
28.70
11.23
—
28.40
10.97
13.90
19.10
5.10
B
C
-
~ ~ +
D
—
E
—
Mechanical Data
C
G
1.20 Ø Typical
3.05 3.60
H
!
Case: Epoxy Case with Heat Sink Internally
Mounted in the Bridge Encapsulation
Terminals: Plated Leads Solderable per
MIL-STD-202, Method 208
D
All Dimensions in mm
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E E
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Polarity: As Marked on Body
Weight: 30 grams (approx.)
Mounting Position: Any
METAL HEATSINK
G
B
Marking: Type Number
H
Maximum Ratings and Electrical Characteristics @TA=25°C unless otherwise specified
Single Phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
KBPC KBPC KBPC KBPC KBPC KBPC KBPC
1000GS 1001GS 1002GS 1004GS 1006GS 1008GS 1010GS
Characteristic
Symbol
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
50
35
100
70
200
140
400
600
420
800
560
1000
700
V
RMS Reverse Voltage
VR(RMS)
IO
280
10
V
A
Average Rectified Output Current @TA = 50°C
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on
rated load (JEDEC Method)
I
FSM
200
1.1
A
Forward Voltage (per element)
@IF = 5.0A
VFM
IR
V
Peak Reverse Current
@TC= 25°C
5.0
500
µA
At Rated DC Blocking Voltage @TC= 125°C
Rating for Fusing (t < 8.3ms) (Note 1)
Typical Thermal Resistance (Note 2)
I2t
374
2.0
A2s
K/W
V
RꢀJC
VISO
RMS Isolation Voltage from Case to Lead
Operating and Storage Temperature Range
2500
Tj, TSTG
-65 to +150
°C
Note: 1. Non-repetitive for t > 1ms and < 8.3ms.
2. Thermal resistance junction to case per element mounted on 220 x 220 x 50mm thick AL plate.
KBPC1000GS – KBPC1010GS
1 of 3
© 2002 Won-Top Electronics