CURRENT 4.0 Amperes
VOLTAGE 50 to 1000 Volts
KBJ2A THRU KBJ2M
Features
· Glass Passivated Die Construction
· High Case Dielectric Strength
· Low Reverse Leakage Current
0.825 (20.9)
0.815 (20.7)
0.125 (3.17)
x 45 degrees
C hamfer
·
High surge current capability
· Ideal for Printed Circuit Board Applications
· Plastic Material - UL Flammability Classification 94V-0
0.421 (10.7)
0.411 (10.4)
0.080 (2.03)
0.060 (1.50)
0.098 (2.5)
0.075 (1.9)
0.718 (18.2)
0.682 (17.3)
Lead Depth
0.095 (2.41)
0.080 (2.03)
0.098 (2.5)
0.075 (1.9)
Mechanical Data
0.022 (0.56)
0.050 (1.27)
0.040 (1.02)
C as e: Molded plastic body over passivated junctions
0.018 (0.46)
Terminals : P lated leads solderable per MIL-S TD-750,
Method 2026
(5.3)
(4.8)
0.210
0.190
High temperature soldering guaranteed:
260℃/10 seconds , 0.375" (9.5mm) lead length,
5lbs. (2.3kg) tension
0.040 (1.02)
0.030 (0.76)
0.140 (3.56)
0.128 (3.25)
0.022 (0.56)
0.018 (0.46)
Mounting Pos ition: Any
Weight: 0.071 oz., 2.0 g
P olarity shown on front side of case, positive lead beveled corner.
Dimensions in inches and (millimeters)
Packaging codes /options :
1/400 E A. per Bulk Tray S tack
Maximum Ratings And Electrical Characteristics
(Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive
load. For capacitive load, derate by 20%)
KBJ
2A
KBJ
2B
KBJ
2C
KBJ
2G
KBJ
2J
KBJ
2K
KBJ
2M
Symbols
Units
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
V
RMM
RWM
50
35
100
70
200
140
400
600
420
800
560
1000
700
Volts
R
RMS Reverse voltage
V
R(RMS)
280
Volts
Maximum average forward @ TC =50
℃
R ectified output current at @ TA=40℃
4.0
3.0
Io
Amps
Non-Repetitive Peak Forward Surge Current,
8.3ms single half-sine-wave superimposed
on rated load per element (JEDEC method)
IFSM
150
Amps
V
FM
1.0
Volts
μA
pF
Forward Voltage (per element)
@ IF=4.0 A
@ TC
=25℃
5.0
Peak Reverse Current at Rated
DC Blocking Voltage
IRM
@ TC
=125℃
500
Typical Junction Capacitance (Note 1)
C
j
40
Typical Thermal Resistance,
Junction to Case (Note 2)
22
℃/W
RθJC
T
STG
j
Operating and Storage Temperature Range
-55 to +150
℃
T
Notes:
(1) Thermal resistance from junction to case per element. Unit mounted on 300 x 300 x 16mm aluminum plate heat sink.
(2) Measured at 1.0MHz and Applied Reverse Voltage of 4.0V DC.