是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | LFBGA, BGA137,10X15,32 | 针数: | 137 |
Reach Compliance Code: | compliant | HTS代码: | 8542.32.00.71 |
风险等级: | 5.84 | 最长访问时间: | 30 ns |
其他特性: | NAND FLASH IS ORGANIZED AS 64M X 8; NAND FLASH OPERATES AT 2.5V TO 2.9V SUPPLY | JESD-30 代码: | R-PBGA-B137 |
JESD-609代码: | e1 | 长度: | 13 mm |
内存密度: | 268435456 bit | 内存集成电路类型: | MEMORY CIRCUIT |
内存宽度: | 32 | 混合内存类型: | FLASH+SDRAM |
湿度敏感等级: | 2 | 功能数量: | 1 |
端子数量: | 137 | 字数: | 8388608 words |
字数代码: | 8000000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -25 °C |
组织: | 8MX32 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LFBGA | 封装等效代码: | BGA137,10X15,32 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 2.7 V |
认证状态: | Not Qualified | 座面最大高度: | 1.4 mm |
最大待机电流: | 0.001 A | 子类别: | Other Memory ICs |
最大压摆率: | 0.02 mA | 最大供电电压 (Vsup): | 1.95 V |
最小供电电压 (Vsup): | 1.7 V | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子面层: | TIN SILVER COPPER |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 10.5 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
KBE00G003M | SAMSUNG |
获取价格 |
NAND 512Mb*2 + Mobile SDRAM 256Mb*2 | |
KBE00G003M-D411 | SAMSUNG |
获取价格 |
NAND 512Mb*2 + Mobile SDRAM 256Mb*2 | |
KBE00S003M | SAMSUNG |
获取价格 |
1Gb NAND*2 + 256Mb Mobile SDRAM*2 | |
KBE00S003M-D411 | SAMSUNG |
获取价格 |
1Gb NAND*2 + 256Mb Mobile SDRAM*2 | |
KBE00S009M | SAMSUNG |
获取价格 |
1Gb NAND x 2 + 256Mb Mobile SDRAM x 2 | |
KBE00S009M-D411 | SAMSUNG |
获取价格 |
1Gb NAND x 2 + 256Mb Mobile SDRAM x 2 | |
KBE00S009M-D4110 | SAMSUNG |
获取价格 |
Memory Circuit, 16MX16, CMOS, PBGA137, 12 X 14 MM, 0.80 MM PITCH, LEAD FREE, FBGA-137 | |
KB-E100SRD | KINGBRIGHT |
获取价格 |
SINGLE COLOR LED ARRAY, HYPER RED, 8.89mm, | |
KBE100SRW | KINGBRIGHT |
获取价格 |
SINGLE COLOR LED ARRAY, SUPER BRIGHT RED, 8.89 mm, ROHS COMPLIANT PACKAGE-16 | |
KB-E100SRW | KINGBRIGHT |
获取价格 |
LED LIGHT BARS |