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KBE00F005A-D4110 PDF预览

KBE00F005A-D4110

更新时间: 2024-02-07 01:22:29
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器内存集成电路
页数 文件大小 规格书
87页 1353K
描述
Memory Circuit, Flash+SDRAM, 8MX32, CMOS, PBGA137, 10.50 X 13 MM, 0.80 MM PITCH, LEAD FREE, FBGA-137

KBE00F005A-D4110 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:LFBGA, BGA137,10X15,32针数:137
Reach Compliance Code:compliantHTS代码:8542.32.00.71
风险等级:5.84最长访问时间:30 ns
其他特性:NAND FLASH IS ORGANIZED AS 64M X 8; NAND FLASH OPERATES AT 2.5V TO 2.9V SUPPLYJESD-30 代码:R-PBGA-B137
JESD-609代码:e1长度:13 mm
内存密度:268435456 bit内存集成电路类型:MEMORY CIRCUIT
内存宽度:32混合内存类型:FLASH+SDRAM
湿度敏感等级:2功能数量:1
端子数量:137字数:8388608 words
字数代码:8000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-25 °C
组织:8MX32封装主体材料:PLASTIC/EPOXY
封装代码:LFBGA封装等效代码:BGA137,10X15,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):260电源:2.7 V
认证状态:Not Qualified座面最大高度:1.4 mm
最大待机电流:0.001 A子类别:Other Memory ICs
最大压摆率:0.02 mA最大供电电压 (Vsup):1.95 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子面层:TIN SILVER COPPER
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
宽度:10.5 mmBase Number Matches:1

KBE00F005A-D4110 数据手册

 浏览型号KBE00F005A-D4110的Datasheet PDF文件第2页浏览型号KBE00F005A-D4110的Datasheet PDF文件第3页浏览型号KBE00F005A-D4110的Datasheet PDF文件第4页浏览型号KBE00F005A-D4110的Datasheet PDF文件第5页浏览型号KBE00F005A-D4110的Datasheet PDF文件第6页浏览型号KBE00F005A-D4110的Datasheet PDF文件第7页 
KBE00F005A-D411  
MCP MEMORY  
MCP Specification  
512Mb NAND*2 + 256Mb Mobile SDRAM*2  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,  
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.  
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,  
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,  
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL  
INFORMATION IN THIS DOCUMENT IS PROVIDED  
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar  
applications where Product failure couldresult in loss of life or personal or physical harm, or any military or  
defense application, or any governmental procurement to which special terms or provisions may apply.  
* Samsung Electronics reserves the right to change products or specification without notice.  
1
Revision 1.0  
June 2005  

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