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K9W8G08U1M-YCB0T PDF预览

K9W8G08U1M-YCB0T

更新时间: 2024-11-21 14:51:51
品牌 Logo 应用领域
三星 - SAMSUNG 光电二极管内存集成电路
页数 文件大小 规格书
38页 741K
描述
Flash, 1GX8, PDSO48

K9W8G08U1M-YCB0T 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete包装说明:TSSOP, TSSOP48,.8,20
Reach Compliance Code:compliant风险等级:5.92
命令用户界面:YES数据轮询:NO
JESD-30 代码:R-PDSO-G48内存密度:8589934592 bit
内存集成电路类型:FLASH内存宽度:8
湿度敏感等级:1部门数/规模:8K
端子数量:48字数:1073741824 words
字数代码:1000000000最高工作温度:70 °C
最低工作温度:组织:1GX8
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP48,.8,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH页面大小:2K words
并行/串行:PARALLEL峰值回流温度(摄氏度):225
电源:3/3.3 V认证状态:Not Qualified
就绪/忙碌:YES部门规模:128K
最大待机电流:0.0001 A子类别:Flash Memories
最大压摆率:0.03 mA表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
切换位:NO类型:NAND TYPE
Base Number Matches:1

K9W8G08U1M-YCB0T 数据手册

 浏览型号K9W8G08U1M-YCB0T的Datasheet PDF文件第2页浏览型号K9W8G08U1M-YCB0T的Datasheet PDF文件第3页浏览型号K9W8G08U1M-YCB0T的Datasheet PDF文件第4页浏览型号K9W8G08U1M-YCB0T的Datasheet PDF文件第5页浏览型号K9W8G08U1M-YCB0T的Datasheet PDF文件第6页浏览型号K9W8G08U1M-YCB0T的Datasheet PDF文件第7页 
K9W8G08U1M  
K9K4G08U0M  
FLASH MEMORY  
Document Title  
512M x 8 Bit / 1G x 8 Bit NAND Flash Memory  
Revision History  
Revision No History  
Draft Date  
Feb. 19. 2003  
Mar. 31. 2003  
Apr. 9. 2003  
Remark  
Advance  
0.0  
0.1  
0.2  
1. Initial issue  
1. Add two-K9K4GXXU0M-YCB0/YIB0 Stacked Package  
Preliminary  
Preliminary  
1. The 3rd Byte ID after 90h ID read command is don’t cared.  
The 5th Byte ID after 90h ID read command is deleted.  
0.3  
1. The K9W8G16U1M-YCB0,YIB0,PCB0,PIB0 is deleted in line up.  
2. Note is added.  
Apr. 30. 2003  
Preliminary  
(VIL can undershoot to -0.4V and VIH can overshoot to VCC +0.4V for  
durations of 20 ns or less.)  
3. Pb-free Package is added.  
K9K4G08Q0M-PCB0,PIB0  
K9K4G08U0M-PCB0,PIB0  
K9K4G16U0M-PCB0,PIB0  
K9K4G16Q0M-PCB0,PIB0  
K9W8G08U1M-PCB0,PIB0  
Preliminary  
Preliminary  
0.4  
0.5  
1. Added Addressing method for program operation.  
Jan. 27. 2004  
May.31. 2004  
1. The tADL(Address to Data Loading Time) is added.  
- tADL Minimum 100ns  
- tADL is the time from the WE rising edge of final address cycle  
to the WE rising edge of first data cycle at program operation.  
2. Added addressing method for program operation  
3. PKG(TSOP1) Dimension Change  
Preliminary  
Preliminary  
0.6  
1. Technical note is changed  
Feb. 01. 2005  
2. Notes of AC timing characteristics are added  
3. The description of Copy-back program is changed  
4. 1.8V part is deleted  
0.7  
0.8  
1. CE access time : 23ns->35ns (p.11)  
Feb. 14. 2005  
May 4. 2005  
1. The value of tREA is changed.(18ns->20ns)  
2. The value of output load capacitance is changed.  
3. EDO mode is added.  
0.9  
1. The flow chart to creat the initial invalid block table is changed.  
May 6. 2005  
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right  
to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have  
any questions, please contact the SAMSUNG branch office near your office.  
1

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