是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 包装说明: | TSSOP, TSSOP48,.8,20 |
Reach Compliance Code: | compliant | 风险等级: | 5.92 |
最长访问时间: | 25 ns | 命令用户界面: | YES |
数据轮询: | NO | JESD-30 代码: | R-PDSO-G48 |
内存密度: | 4294967296 bit | 内存集成电路类型: | FLASH |
内存宽度: | 8 | 湿度敏感等级: | 1 |
部门数/规模: | 4K | 端子数量: | 48 |
字数: | 536870912 words | 字数代码: | 512000000 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 512MX8 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSSOP | 封装等效代码: | TSSOP48,.8,20 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
页面大小: | 2K words | 并行/串行: | PARALLEL |
峰值回流温度(摄氏度): | 225 | 电源: | 3/3.3 V |
认证状态: | Not Qualified | 就绪/忙碌: | YES |
部门规模: | 128K | 最大待机电流: | 0.00005 A |
子类别: | Flash Memories | 最大压摆率: | 0.03 mA |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 切换位: | NO |
类型: | NAND TYPE | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K9F4G08U1M-ICB0 | SAMSUNG |
获取价格 |
Flash, 512MX8, 25ns, PBGA52 |
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K9F5608B0D-JCB00 | SAMSUNG |
获取价格 |
Flash, 32MX8, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-63 |
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K9F5608B0DJCB000 | SAMSUNG |
获取价格 |
Flash, 32MX8, 45ns, PBGA63, 11 X 9 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-63 |
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K9F5608B0D-JCB0T | SAMSUNG |
获取价格 |
Flash, 32MX8, 30ns, PBGA63 |
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K9F5608B0D-JIB00 | SAMSUNG |
获取价格 |
Flash, 32MX8, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-63 |
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K9F5608B0D-PCB0 | SAMSUNG |
获取价格 |
Flash, 32MX8, 30ns, PDSO48 |
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K9F5608B0D-PCB00 | SAMSUNG |
获取价格 |
Flash, 32MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 |
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K9F5608B0DPIB000 | SAMSUNG |
获取价格 |
Flash, 32MX8, 45ns, PDSO48, 20 X 12 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 |
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K9F5608B0D-PIB0T | SAMSUNG |
获取价格 |
Flash, 32MX8, 30ns, PDSO48 |
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K9F5608D0C | SAMSUNG |
获取价格 |
32M x 8 Bit , 16M x 16 Bit NAND Flash Memory |
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