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K8S2915ETC-DC7E0 PDF预览

K8S2915ETC-DC7E0

更新时间: 2024-11-12 18:31:07
品牌 Logo 应用领域
三星 - SAMSUNG 内存集成电路
页数 文件大小 规格书
60页 1114K
描述
Flash, PBGA44, 7.70 X 6.20 MM, 0.50 MM PITCH, LEAD FREE, FBGA-44

K8S2915ETC-DC7E0 技术参数

生命周期:Active零件包装代码:BGA
包装说明:,针数:44
Reach Compliance Code:compliant风险等级:5.8
JESD-30 代码:R-PBGA-B44内存集成电路类型:FLASH
端子数量:44封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:GRID ARRAY
编程电压:1.8 V表面贴装:YES
端子形式:BALL端子位置:BOTTOM
Base Number Matches:1

K8S2915ETC-DC7E0 数据手册

 浏览型号K8S2915ETC-DC7E0的Datasheet PDF文件第2页浏览型号K8S2915ETC-DC7E0的Datasheet PDF文件第3页浏览型号K8S2915ETC-DC7E0的Datasheet PDF文件第4页浏览型号K8S2915ETC-DC7E0的Datasheet PDF文件第5页浏览型号K8S2915ETC-DC7E0的Datasheet PDF文件第6页浏览型号K8S2915ETC-DC7E0的Datasheet PDF文件第7页 
K8S2815ET(B)C  
NOR FLASH MEMORY  
128Mb C-die SLC NOR Specification  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,  
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.  
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,  
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,  
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL  
INFORMATION IN THIS DOCUMENT IS PROVIDED  
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar  
applications where Product failure could result in loss of life or personal or physical harm, or any military or  
defense application, or any governmental procurement to which special terms or provisions may apply.  
* Samsung Electronics reserves the right to change products or specification without notice.  
1
Revision 1.2  
November 2008  

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Flash, PBGA44, LEAD FREE, FBGA-44
K8S3015EBF-HC7C0 SAMSUNG

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Flash, PBGA44, LEAD FREE, FBGA-44
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Flash, PBGA44, LEAD FREE, FBGA-44
K8S3015EBF-SC7C0 SAMSUNG

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Flash, PBGA44, LEAD FREE, FBGA-44