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K4T1G164QD PDF预览

K4T1G164QD

更新时间: 2024-02-27 10:49:48
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器双倍数据速率
页数 文件大小 规格书
27页 587K
描述
1Gb D-die DDR2 SDRAM Specification

K4T1G164QD 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:BGA, BGA92,9X21,32
Reach Compliance Code:compliant风险等级:5.84
访问模式:MULTI BANK PAGE BURST最长访问时间:0.6 ns
其他特性:AUTO/SELF REFRESH最大时钟频率 (fCLK):200 MHz
I/O 类型:COMMON交错的突发长度:4,8
JESD-30 代码:R-PBGA-B92长度:21.7 mm
内存密度:1073741824 bit内存集成电路类型:DDR DRAM
内存宽度:16湿度敏感等级:3
功能数量:1端口数量:1
端子数量:92字数:67108864 words
字数代码:64000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:
组织:64MX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA92,9X21,32封装形状:RECTANGULAR
封装形式:GRID ARRAY峰值回流温度(摄氏度):260
电源:1.8 V认证状态:Not Qualified
刷新周期:8192座面最大高度:1.2 mm
自我刷新:YES连续突发长度:4,8
子类别:DRAMs最大供电电压 (Vsup):1.9 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:11 mm

K4T1G164QD 数据手册

 浏览型号K4T1G164QD的Datasheet PDF文件第21页浏览型号K4T1G164QD的Datasheet PDF文件第22页浏览型号K4T1G164QD的Datasheet PDF文件第23页浏览型号K4T1G164QD的Datasheet PDF文件第24页浏览型号K4T1G164QD的Datasheet PDF文件第25页浏览型号K4T1G164QD的Datasheet PDF文件第26页 
K4T1G084QD  
K4T1G164QD  
DDR2 SDRAM  
29. Input waveform timing with differential data strobe enabled MR[bit10]=0, is referenced from the input signal crossing at the VIH(ac) level to the differen-  
tial data strobe crosspoint for a rising signal, and from the input signal crossing at the VIL(ac) level to the differential data strobe crosspoint for a falling  
signal applied to the device under test.  
30. Input waveform timing with differential data strobe enabled MR[bit10]=0, is referenced from the input signal crossing at the VIH(dc) level to the differen-  
tial data strobe crosspoint for a rising signal and VIL(dc) to the differential data strobe crosspoint for a falling signal applied to the device under test.  
DQS  
DQS  
tDH  
tDH  
tDS  
tDS  
VDDQ  
VIH(ac) min  
VIH(dc) min  
VREF(dc)  
VIL(dc) max  
VIL(ac) max  
VSS  
< Differential Input waveform timing >  
31. Input waveform timing is referenced from the input signal crossing at the VIH(ac) level for a rising signal and VIL(ac) for a falling signal applied to the  
device under test.  
32. Input waveform timing is referenced from the input signal crossing at the VIL(dc) level for a rising signal and VIH(dc) for a falling signal applied to the  
device under test.  
CK  
CK  
tIH  
tIH  
tIS  
tIS  
V
V
V
V
V
V
V
DDQ  
min  
min  
IH(ac)  
IH(dc)  
REF(dc)  
max  
max  
IL(dc)  
IL(ac)  
SS  
33. tWTR is at lease two clocks (2 * tCK) independent of operation frequency.  
34. Input waveform timing with single-ended data strobe enabled MR[bit10] = 1, is referenced from the input signal crossing at the VIH(ac) level to the  
single-ended data strobe crossing VIH/L(dc) at the start of its transition for a rising signal, and from the input signal crossing at the VIL(ac) level to the  
single-ended data strobe crossing VIH/L(dc) at the start of its transition for a falling signal applied to the device under test. The DQS signal must be  
monotonic between Vil(dc)max and Vih(dc)min.  
35. Input waveform timing with single-ended data strobe enabled MR[bit10] = 1, is referenced from the input signal crossing at the VIH(dc) level to the  
single-ended data strobe crossing VIH/L(ac) at the end of its transition for a rising signal, and from the input signal crossing at the VIL(dc) level to the  
single-ended data strobe crossing VIH/L(ac) at the end of its transition for a falling signal applied to the device under test. The DQS signal must be  
monotonic between Vil(dc)max and Vih(dc)min.  
36. tCKEmin of 3 clocks means CKE must be registered on three consecutive positive clock edges. CKE must remain at the valid input level the entire  
time it takes to achieve the 3 clocks of registeration. Thus, after any cKE transition, CKE may not transitioin from its valid level during the time period  
of tIS + 2*tCK + tIH.  
25 of 29  
Rev. 1.0 March 2007  

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