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K4S561632C-TN60 PDF预览

K4S561632C-TN60

更新时间: 2023-06-15 00:00:00
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器光电二极管
页数 文件大小 规格书
11页 114K
描述
Synchronous DRAM, 16MX16, 5ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, TSOP2-54

K4S561632C-TN60 数据手册

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K4S561632C  
CMOS SDRAM  
AC OPERATING TEST CONDITIONS (VDD = 3.3V ± 0.3V, TA = -25 to 85°C)  
Parameter  
AC input levels (Vih/Vil)  
Value  
2.4/0.4  
1.4  
Unit  
V
Input timing measurement reference level  
Input rise and fall time  
V
tr/tf = 1/1  
1.4  
ns  
V
Output timing measurement reference level  
Output load condition  
See Fig. 2  
3.3V  
Vtt = 1.4V  
1200W  
50W  
VOH (DC) = 2.4V, IOH = -2mA  
VOL (DC) = 0.4V, IOL = 2mA  
Z0 = 50W  
Output  
Output  
50pF  
50pF  
870W  
(Fig. 1) DC output load circuit  
(Fig. 2) AC output load circuit  
Notes :  
1. The DC/AC Test Output Load of K4S561632C-TC(L)60 is 30pF.  
2. The VDD condition of K4S561632C-TC(L)60 is 3.135V~3.6V.  
OPERATING AC PARAMETER  
(AC operating conditions unless otherwise noted)  
Version  
Parameter  
Symbol  
Unit  
Note  
-60  
12  
18  
18  
42  
-7C  
-75  
-1H  
20  
20  
20  
50  
-1L  
20  
20  
20  
50  
Row active to row active delay  
RAS to CAS delay  
tRRD(min)  
tRCD(min)  
tRP(min)  
15  
15  
15  
45  
15  
ns  
ns  
ns  
ns  
us  
ns  
CLK  
-
1
1
1
1
20  
Row precharge time  
20  
tRAS(min)  
tRAS(max  
tRC(min)  
tRDL(min)  
tDAL(min)  
45  
Row active time  
100  
Row cycle time  
60  
60  
65  
70  
70  
1
2, 5  
5
Last data in to row precharge  
Last data in to Active delay  
2
2 CLK + tRP  
Last data in to new col. address delay  
Last data in to burst stop  
tCDL(min)  
tBDL(min)  
tCCD(min)  
1
1
1
2
1
CLK  
CLK  
CLK  
2
2
3
Col. address to col. address delay  
CAS latency=3  
CAS latency=2  
Number of valid output  
data  
ea  
4
-
Notes :  
1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time  
and then rounding off to the next higher integer.  
2. Minimum delay is required to complete write.  
3. All parts allow every cycle column address change.  
4. In case of row precharge interrupt, auto precharge and read burst stop.  
5. In 100MHz and below 100MHz operating conditions, tRDL=1CLK and tDAL=1CLK + 20ns is also supported.  
SAMSUNG recommends tRDL=2CLK and tDAL=2CLK + tRP.  
Rev.0.1 Sept.2001  

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