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K4S51323PF-MF90 PDF预览

K4S51323PF-MF90

更新时间: 2024-11-17 22:30:15
品牌 Logo 应用领域
三星 - SAMSUNG 存储内存集成电路动态存储器手机时钟
页数 文件大小 规格书
12页 143K
描述
4M x 32Bit x 4 Banks Mobile-SDRAM

K4S51323PF-MF90 技术参数

是否Rohs认证: 不符合生命周期:Active
Reach Compliance Code:compliant风险等级:5.83
最长访问时间:7 ns最大时钟频率 (fCLK):111 MHz
I/O 类型:COMMON交错的突发长度:1,2,4,8
JESD-30 代码:R-PBGA-B90JESD-609代码:e0
内存密度:536870912 bit内存集成电路类型:SYNCHRONOUS DRAM
内存宽度:32端子数量:90
字数:16777216 words字数代码:16000000
最高工作温度:70 °C最低工作温度:-25 °C
组织:16MX32输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:FBGA
封装等效代码:BGA90,9X15,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, FINE PITCH电源:1.8 V
认证状态:Not Qualified刷新周期:8192
连续突发长度:1,2,4,8,FP最大待机电流:0.0006 A
子类别:DRAMs最大压摆率:0.17 mA
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
Base Number Matches:1

K4S51323PF-MF90 数据手册

 浏览型号K4S51323PF-MF90的Datasheet PDF文件第2页浏览型号K4S51323PF-MF90的Datasheet PDF文件第3页浏览型号K4S51323PF-MF90的Datasheet PDF文件第4页浏览型号K4S51323PF-MF90的Datasheet PDF文件第5页浏览型号K4S51323PF-MF90的Datasheet PDF文件第6页浏览型号K4S51323PF-MF90的Datasheet PDF文件第7页 
K4S51323PF-M(E)F  
Mobile-SDRAM  
4M x 32Bit x 4 Banks Mobile-SDRAM  
FEATURES  
GENERAL DESCRIPTION  
• 1.8V power supply.  
The K4S51323PF is 536,870,912 bits synchronous high data  
rate Dynamic RAM organized as 4 x 4,196,304 words by 32 bits,  
fabricated with SAMSUNG’s high performance CMOS technol-  
ogy. Synchronous design allows precise cycle control with the  
use of system clock and I/O transactions are possible on every  
clock cycle. Range of operating frequencies, programmable  
burst lengths and programmable latencies allow the same  
device to be useful for a variety of high bandwidth and high per-  
• LVCMOS compatible with multiplexed address.  
• Four banks operation.  
• MRS cycle with address key programs.  
-. CAS latency (1, 2 & 3).  
-. Burst length (1, 2, 4, 8 & Full page).  
-. Burst type (Sequential & Interleave).  
• EMRS cycle with address key programs.  
• All inputs are sampled at the positive going edge of the system formance memory system applications.  
clock.  
• Burst read single-bit write operation.  
• Special Function Support.  
-. PASR (Partial Array Self Refresh).  
-. Internal TCSR (Temperature Compensated Self Refresh)  
-. DS (Driver Strength)  
• DQM for masking.  
• Auto refresh.  
• 64ms refresh period (8K cycle).  
• Commercial Temperature Operation (-25°C ~ 70°C).  
• 2Chips DDP 90Balls FBGA( -MXXX -Pb, -EXXX -Pb Free).  
ORDERING INFORMATION  
Part No.  
Max Freq.  
Interface  
Package  
K4S51323PF-M(E)F75  
K4S51323PF-M(E)F90  
K4S51323PF-M(E)F1L  
133MHz(CL=3),83MHz(CL=2)  
111MHz(CL=3),83MHz(CL=2)  
90 FBGA Pb  
(Pb Free)  
LVCMOS  
111MHz(CL=3)*1,66MHz(CL2)  
- M(E)F : Low Power, Commercial Temperature(-25°C ~ 70°C)  
Notes :  
1. In case of 40MHz Frequency, CL1 can be supported.  
2. Samsung are not designed or manufactured for use in a device or system that is used under circumstance in which human life is  
potentially at stake. Please contact to the memory marketing team in samsung electronics when considering the use of a product  
contained herein for any specific purpose, such as medical, aerospace, nuclear, military, vehicular or undersea repeater use.  
Address configuration  
Organization  
Bank  
Row  
Column Address  
16Mx32  
BA0,BA1  
A0 - A12  
A0 - A8  
1
September 2004  

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