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K4M51163PC-RG75T PDF预览

K4M51163PC-RG75T

更新时间: 2024-11-12 09:04:03
品牌 Logo 应用领域
三星 - SAMSUNG 时钟动态存储器内存集成电路
页数 文件大小 规格书
12页 115K
描述
Synchronous DRAM, 32MX16, 6ns, CMOS, PBGA54

K4M51163PC-RG75T 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete包装说明:FBGA, BGA54,9X9,32
Reach Compliance Code:compliant风险等级:5.92
最长访问时间:6 ns最大时钟频率 (fCLK):133 MHz
I/O 类型:COMMON交错的突发长度:1,2,4,8
JESD-30 代码:S-PBGA-B54内存密度:536870912 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:16
湿度敏感等级:1端子数量:54
字数:33554432 words字数代码:32000000
最高工作温度:85 °C最低工作温度:-25 °C
组织:32MX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:FBGA
封装等效代码:BGA54,9X9,32封装形状:SQUARE
封装形式:GRID ARRAY, FINE PITCH峰值回流温度(摄氏度):225
电源:1.8 V认证状态:Not Qualified
刷新周期:8192连续突发长度:1,2,4,8,FP
最大待机电流:0.0003 A子类别:DRAMs
最大压摆率:0.15 mA标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

K4M51163PC-RG75T 数据手册

 浏览型号K4M51163PC-RG75T的Datasheet PDF文件第2页浏览型号K4M51163PC-RG75T的Datasheet PDF文件第3页浏览型号K4M51163PC-RG75T的Datasheet PDF文件第4页浏览型号K4M51163PC-RG75T的Datasheet PDF文件第5页浏览型号K4M51163PC-RG75T的Datasheet PDF文件第6页浏览型号K4M51163PC-RG75T的Datasheet PDF文件第7页 
K4M51163PC - R(B)E/G/C/F  
Mobile SDRAM  
8M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA  
FEATURES  
GENERAL DESCRIPTION  
• 1.8V power supply.  
The K4M51163PC is 536,870,912 bits synchronous high data  
rate Dynamic RAM organized as 4 x 8,388,608 words by 16 bits,  
fabricated with SAMSUNG’s high performance CMOS technol-  
ogy. Synchronous design allows precise cycle control with the  
use of system clock and I/O transactions are possible on every  
clock cycle. Range of operating frequencies, programmable  
burst lengths and programmable latencies allow the same  
device to be useful for a variety of high bandwidth and high per-  
• LVCMOS compatible with multiplexed address.  
• Four banks operation.  
• MRS cycle with address key programs.  
-. CAS latency (1, 2 & 3).  
-. Burst length (1, 2, 4, 8 & Full page).  
-. Burst type (Sequential & Interleave).  
• EMRS cycle with address key programs.  
• All inputs are sampled at the positive going edge of the system formance memory system applications.  
clock.  
• Burst read single-bit write operation.  
• Special Function Support.  
-. PASR (Partial Array Self Refresh).  
-. Internal TCSR (Temperature Compensated Self Refresh)  
-. DS (Driver Strength)  
-. DPD (Deep Power Down Mode)  
• DQM for masking.  
• Auto refresh.  
• 64ms refresh period (8K cycle).  
• Commercial Temperature Operation (-25°C ~ 70°C).  
• Extended Temperature Operation (-25°C ~ 85°C).  
• 54Balls FBGA (-RXXX : Pb, -BXXX : Pb Free).  
ORDERING INFORMATION  
Part No.  
Max Freq.  
Interface  
Package  
K4M51163PC-R(B)E/G/C/F75  
K4M51163PC-R(B)E/G/C/F90  
K4M51163PC-R(B)E/G/C/F1L  
133MHz(CL=3), 83MHz(CL=2)  
111MHz(CL=3), 83MHz(CL=2)  
54 FBGA Pb  
(Pb Free)  
LVCMOS  
111MHz(CL=3)*1, 66MHz(CL=2)  
- R(B)E/G : Normal/Low Power, Extended Temperature(-25°C ~ 85°C)  
- R(B)C/F : Normal/Low Power, Commercial Temperature(-25°C ~ 70°C)  
Notes :  
1. In case of 40MHz Frequency, CL1 can be supported.  
Address configuration  
Organization  
Bank  
Row  
A0 - A12  
Column Address  
32M x 16  
BA0, BA1  
A0 - A9  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.  
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,  
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PRO-  
VIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure could  
result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or pro-  
visions may apply.  
February 2006  

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