是否Rohs认证: | 符合 | 生命周期: | Obsolete |
包装说明: | FBGA, BGA90,9X15,32 | Reach Compliance Code: | unknown |
风险等级: | 5.84 | 最长访问时间: | 60 ns |
最大时钟频率 (fCLK): | 166 MHz | I/O 类型: | COMMON |
交错的突发长度: | 1,2,4,8 | JESD-30 代码: | R-PBGA-B90 |
内存密度: | 134217728 bit | 内存集成电路类型: | SYNCHRONOUS DRAM |
内存宽度: | 32 | 端子数量: | 90 |
字数: | 4194304 words | 字数代码: | 4000000 |
最高工作温度: | 85 °C | 最低工作温度: | -25 °C |
组织: | 4MX32 | 输出特性: | 3-STATE |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | FBGA |
封装等效代码: | BGA90,9X15,32 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, FINE PITCH | 电源: | 3/3.3 V |
认证状态: | Not Qualified | 刷新周期: | 4096 |
连续突发长度: | 1,2,4,8,FP | 最大待机电流: | 0.0005 A |
子类别: | DRAMs | 最大压摆率: | 0.14 mA |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K4M283233H-HN75 | SAMSUNG |
获取价格 |
Synchronous DRAM, 4MX32, 7.5ns, CMOS, PBGA90 | |
K4M283233H-HN75T | SAMSUNG |
获取价格 |
Synchronous DRAM, 4MX32, 5.4ns, CMOS, PBGA90, LEAD FREE, FBGA-90 | |
K4M283233H-NG60 | SAMSUNG |
获取价格 |
1M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA | |
K4M283233H-NG75 | SAMSUNG |
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1M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA | |
K4M283233H-NG7L | SAMSUNG |
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1M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA | |
K4M283233H-NL60 | SAMSUNG |
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1M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA | |
K4M283233H-NL75 | SAMSUNG |
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1M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA | |
K4M283233H-NL7L | SAMSUNG |
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1M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA | |
K4M28323LH | SAMSUNG |
获取价格 |
1M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA | |
K4M28323LH-FF60T | SAMSUNG |
获取价格 |
Synchronous DRAM, 4MX32, 5.4ns, CMOS, PBGA90 |