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JANS2N7237U PDF预览

JANS2N7237U

更新时间: 2024-11-26 14:56:39
品牌 Logo 应用领域
英飞凌 - INFINEON 开关脉冲晶体管
页数 文件大小 规格书
7页 1207K
描述
-200V Single P-Channel Hi-Rel MOSFET in a SMD-1 package - A JANS2N7237U with Hermetic Packaging

JANS2N7237U 技术参数

是否Rohs认证:不符合生命周期:Active
包装说明:HERMETIC SEALED, SMD1, 3 PINReach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.16
Is Samacsys:N其他特性:HIGH RELIABILITY
雪崩能效等级(Eas):500 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:200 V
最大漏极电流 (Abs) (ID):11 A最大漏极电流 (ID):11 A
最大漏源导通电阻:0.52 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-CBCC-N3JESD-609代码:e0
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:RECTANGULAR
封装形式:CHIP CARRIER峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):125 W
最大脉冲漏极电流 (IDM):44 A认证状态:Qualified
参考标准:MIL-19500/595子类别:Other Transistors
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:NO LEAD端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

JANS2N7237U 数据手册

 浏览型号JANS2N7237U的Datasheet PDF文件第2页浏览型号JANS2N7237U的Datasheet PDF文件第3页浏览型号JANS2N7237U的Datasheet PDF文件第4页浏览型号JANS2N7237U的Datasheet PDF文件第5页浏览型号JANS2N7237U的Datasheet PDF文件第6页浏览型号JANS2N7237U的Datasheet PDF文件第7页 
PD- 91554F  
IRFN9240  
JANTX2N7237U  
JANTXV2N7237U  
JANS2N7237U  
200V, P-CHANNEL  
POWER MOSFET  
SURFACE MOUNT(SMD-1)  
REF: MIL-PRF-19500/595  
HEXFET® MOSFET TECHNOLOGY  
Product Summary  
Part Number  
RDS(on)  
ID  
IRFN9240  
-11A  
0.51  
SMD-1  
Description  
Features  
HEXFET® MOSFET technology is the key to IR Hirel advanced  
line of power MOSFET transistors. The efficient geometry design  
achieves very low on-state resistance combined with high  
transconductance. HEXFET transistors also feature all of the  
well-established advantages of MOSFETs, such as voltage  
control, very fast switching and electrical parameter temperature  
stability. They are well-suited for applications such as switching  
power supplies, motor controls, inverters, choppers, audio  
amplifiers, high energy pulse circuits, and virtually any  
application where high reliability is required. The HEXFET  
transistors totally isolated package eliminates the need for  
additional isolating material between the device and the  
heatsink. This improves thermal efficiency and reduces drain  
capacitance.  
Simple Drive Requirements  
Hermetically Sealed  
Surface Mount  
Dynamic dv/dt Rating  
Light Weight  
Absolute Maximum Ratings  
Symbol  
Value  
Parameter  
Units  
ID1 @ VGS = -10V, TC = 25°C Continuous Drain Current  
ID2 @ VGS = -10V, TC = 100°C Continuous Drain Current  
-11  
A
-7.0  
-44  
IDM @TC = 25°C  
PD @TC = 25°C  
Pulsed Drain Current   
Maximum Power Dissipation  
125  
1.0  
W
W/°C  
V
Linear Derating Factor  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy   
Avalanche Current   
± 20  
500  
-11  
mJ  
A
EAR  
dv/dt  
TJ  
12.5  
-5.0  
mJ  
V/ns  
Repetitive Avalanche Energy   
Peak Diode Recovery   
Operating Junction and  
-55 to + 150  
TSTG  
Storage Temperature Range  
Package Mounting Surface Temperature  
Weight  
°C  
g
300 (for 5 S)  
2.6 (Typical)  
For footnotes refer to the page 2.  
1
2020-06-22  
International Rectifier HiRel Products, Inc.  

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