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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| IT18B | ETC |
获取价格 |
ISOTAB TRIACS ELECTRICALLY ISOLATED |
|
| IT18HA | ETC |
获取价格 |
ISOTAB TRIACS ELECTRICALLY ISOLATED |
|
| IT18HA/HX | HUTSON |
获取价格 |
Trigger Device |
|
| IT18HX | ETC |
获取价格 |
ISOTAB TRIACS ELECTRICALLY ISOLATED |
|
| IT1A-168P-SV | HRS |
获取价格 |
High Speed, Matched-Impedance, Parallel Board-to-board Connector |
|
| IT1A-168S-SV | HRS |
获取价格 |
High Speed, Matched-Impedance, Parallel Board-to-board Connector System |
|
| IT1A-252P-SV | HRS |
获取价格 |
High Speed, Matched-Impedance, Parallel Board-to-board Connector |
|
| IT1A-252S-SV | HRS |
获取价格 |
High Speed, Matched-Impedance, Parallel Board-to-board Connector System |
|
| IT1C-84P/14-30H(04) | HRS |
获取价格 |
Board Stacking Connector |
|
| IT1C-84P/14-30H(40) | HRS |
获取价格 |
Card Edge Connector |
|
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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