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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| IT1A-168P-SV | HRS |
获取价格 |
High Speed, Matched-Impedance, Parallel Board-to-board Connector |
|
| IT1A-168S-SV | HRS |
获取价格 |
High Speed, Matched-Impedance, Parallel Board-to-board Connector System |
|
| IT1A-252P-SV | HRS |
获取价格 |
High Speed, Matched-Impedance, Parallel Board-to-board Connector |
|
| IT1A-252S-SV | HRS |
获取价格 |
High Speed, Matched-Impedance, Parallel Board-to-board Connector System |
|
| IT1C-84P/14-30H(04) | HRS |
获取价格 |
Board Stacking Connector |
|
| IT1C-84P/14-30H(40) | HRS |
获取价格 |
Card Edge Connector |
|
| IT210 | ETC |
获取价格 |
ISOTAB TRIACS ELECTRICALLY ISOLATED |
|
| IT210A | HUTSON |
获取价格 |
4 Quadrant Logic Level TRIAC, 200V V(DRM), 10A I(T)RMS, TO-220AB, HERMETIC SEALED, TO-220, |
|
| IT210B | HUTSON |
获取价格 |
4 Quadrant Logic Level TRIAC, 200V V(DRM), 10A I(T)RMS, TO-220AB, HERMETIC SEALED, TO-220, |
|
| IT210HA | ETC |
获取价格 |
ISOTAB TRIACS ELECTRICALLY ISOLATED |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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