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ISL81485IBZ PDF预览

ISL81485IBZ

更新时间： 2024-01-03 08:46:35
品牌 Logo 应用领域
英特矽尔 - INTERSIL 驱动器接口集成电路光电二极管信息通信管理
页数 文件大小 规格书
11页 378K
描述
5V, 30Mbps, RS-485/RS-422 Transceiver

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ISL81485IBZ 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：TSSOP
包装说明：TSSOP, TSSOP8,.19针数：8
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.63
差分输出：YES驱动器位数：1
高电平输入电流最大值：0.000001 A输入特性：DIFFERENTIAL SCHMITT TRIGGER
接口集成电路类型：LINE TRANSCEIVER接口标准：EIA-422; EIA-485
JESD-30 代码：S-PDSO-G8JESD-609代码：e3
长度：3 mm湿度敏感等级：2
功能数量：1端子数量：8
最高工作温度：85 °C最低工作温度：-40 °C
最小输出摆幅：1.5 V最大输出低电流：0.004 A
封装主体材料：PLASTIC/EPOXY封装代码：TSSOP
封装等效代码：TSSOP8,.19封装形状：SQUARE
封装形式：SMALL OUTLINE, THIN PROFILE, SHRINK PITCH峰值回流温度（摄氏度）：260
电源：5 V认证状态：Not Qualified
最大接收延迟：30 ns接收器位数：1
座面最大高度：1.1 mm子类别：Line Driver or Receivers
最大压摆率：2.2 mA最大供电电压：5.5 V
最小供电电压：4.5 V标称供电电压：5 V
表面贴装：YES技术：BICMOS
温度等级：INDUSTRIAL端子面层：Matte Tin (Sn) - annealed
端子形式：GULL WING端子节距：0.65 mm
端子位置：DUAL处于峰值回流温度下的最长时间：40
最大传输延迟：15 ns宽度：3 mm
Base Number Matches：1

ISL81485IBZ 数据手册

 浏览型号ISL81485IBZ的Datasheet PDF文件第5页浏览型号ISL81485IBZ的Datasheet PDF文件第6页浏览型号ISL81485IBZ的Datasheet PDF文件第7页浏览型号ISL81485IBZ的Datasheet PDF文件第8页浏览型号ISL81485IBZ的Datasheet PDF文件第9页浏览型号ISL81485IBZ的Datasheet PDF文件第10页 
ISL81485  
Small Outline Plastic Packages (SOIC)  
M8.15 (JEDEC MS-012-AA ISSUE C)  
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC  
PACKAGE  
N
INDEX  
AREA  
0.25(0.010)  
M
B M  
H
E
INCHES  
MILLIMETERS  
-B-  
SYMBOL  
MIN  
MAX  
MIN  
1.35  
0.10  
0.33  
0.19  
4.80  
3.80  
MAX  
1.75  
0.25  
0.51  
0.25  
5.00  
4.00  
NOTES  
A
A1  
B
C
D
E
e
0.0532  
0.0040  
0.013  
0.0688  
0.0098  
0.020  
-
1
2
3
L
-
9
SEATING PLANE  
A
0.0075  
0.1890  
0.1497  
0.0098  
0.1968  
0.1574  
-
-A-  
o
h x 45  
D
3
4
-C-  
α
µ
0.050 BSC  
1.27 BSC  
-
e
A1  
H
h
0.2284  
0.0099  
0.016  
0.2440  
0.0196  
0.050  
5.80  
0.25  
0.40  
6.20  
0.50  
1.27  
-
C
B
0.10(0.004)  
5
0.25(0.010) M  
C A M B S  
L
6
N
α
8
8
7
NOTES:  
o
o
o
o
0
8
0
8
-
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
Publication Number 95.  
Rev. 0 12/93  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Dimension “D” does not include mold flash, protrusions or gate burrs.  
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006  
inch) per side.  
4. Dimension “E” does not include interlead flash or protrusions. Inter-  
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per  
side.  
5. The chamfer on the body is optional. If it is not present, a visual index  
feature must be located within the crosshatched area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater  
above the seating plane, shall not exceed a maximum value of  
0.61mm (0.024 inch).  
10. Controlling dimension: MILLIMETER. Converted inch dimensions  
are not necessarily exact.  
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
11  
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