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ISL73096RH_09 PDF预览

ISL73096RH_09

更新时间: 2022-12-20 08:18:19
品牌 Logo 应用领域
英特矽尔 - INTERSIL 晶体晶体管
页数 文件大小 规格书
5页 232K
描述
Radiation Hardened Ultra High Frequency NPN/PNP Transistor Arrays

ISL73096RH_09 数据手册

 浏览型号ISL73096RH_09的Datasheet PDF文件第1页浏览型号ISL73096RH_09的Datasheet PDF文件第2页浏览型号ISL73096RH_09的Datasheet PDF文件第3页浏览型号ISL73096RH_09的Datasheet PDF文件第4页 
ISL73096RH, ISL73127RH, ISL73128RH  
Ceramic Metal Seal Flatpack Packages (Flatpack)  
K16.A MIL-STD-1835 CDFP4-F16 (F-5A, CONFIGURATION B)  
16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE  
A
A
e
INCHES MILLIMETERS  
MIN  
PIN NO. 1  
ID AREA  
SYMBOL  
MAX  
0.115  
0.022  
0.019  
0.009  
0.006  
0.440  
0.285  
0.315  
-
MIN  
1.14  
0.38  
0.38  
0.10  
0.10  
-
MAX  
2.92  
0.56  
0.48  
0.23  
0.15  
11.18  
7.24  
8.00  
-
NOTES  
A
b
0.045  
0.015  
0.015  
0.004  
0.004  
-
-
-
D
-A-  
-B-  
S1  
b1  
c
-
-
b
c1  
D
-
E1  
3
-
0.004  
Q
H
A - B  
D
S
0.036  
M
H
A - B  
S
C
D
S
M
S
E
0.245  
-
6.22  
-
E1  
E2  
E3  
e
3
-
E
-D-  
0.130  
0.030  
3.30  
0.76  
A
-H-  
-
-
7
-
-C-  
L
E2  
L
E3  
E3  
0.050 BSC  
1.27 BSC  
SEATING AND  
BASE PLANE  
k
0.008  
0.250  
0.026  
0.005  
-
0.015  
0.370  
0.045  
-
0.20  
6.35  
0.66  
0.13  
-
0.38  
9.40  
1.14  
-
2
-
c1  
LEAD FINISH  
L
Q
S1  
M
N
8
6
-
BASE  
METAL  
(c)  
b1  
0.0015  
0.04  
M
M
(b)  
16  
16  
-
Rev. 1 2-20-95  
SECTION A-A  
NOTES:  
1. Index area: A notch or a pin one identification mark shall be locat-  
ed adjacent to pin one and shall be located within the shaded  
area shown. The manufacturer’s identification shall not be used  
as a pin one identification mark. Alternately, a tab (dimension k)  
may be used to identify pin one.  
2. If a pin one identification mark is used in addition to a tab, the lim-  
its of dimension k do not apply.  
3. This dimension allows for off-center lid, meniscus, and glass  
overrun.  
4. Dimensions b1 and c1 apply to lead base metal only. Dimension  
M applies to lead plating and finish thickness. The maximum lim-  
its of lead dimensions b and c or M shall be measured at the cen-  
troid of the finished lead surfaces, when solder dip or tin plate  
lead finish is applied.  
5. N is the maximum number of terminal positions.  
6. Measure dimension S1 at all four corners.  
7. For bottom-brazed lead packages, no organic or polymeric mate-  
rials shall be molded to the bottom of the package to cover the  
leads.  
8. Dimension Q shall be measured at the point of exit (beyond the  
meniscus) of the lead from the body. Dimension Q minimum  
shall be reduced by 0.0015 inch (0.038mm) maximum when sol-  
der dip lead finish is applied.  
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.  
10. Controlling dimension: INCH  
FN6475.2  
March 23, 2009  
5

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