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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| ISD17210EYR | WINBOND |
获取价格 |
Multi-Message Single-Chip Voice Record & Playback Devices |
|
| ISD17210EYR01 | WINBOND |
获取价格 |
Multi-Message Single-Chip Voice Record & Playback Devices |
|
| ISD17210PIR | WINBOND |
获取价格 |
Audio Synthesizer IC, |
|
| ISD17210PIR01 | WINBOND |
获取价格 |
Audio Synthesizer IC, |
|
| ISD17210PR01 | WINBOND |
获取价格 |
Audio Synthesizer IC, |
|
| ISD17210PY | WINBOND |
获取价格 |
Multi-Message Single-Chip Voice Record & Playback Devices |
|
| ISD17210PY01 | WINBOND |
获取价格 |
Multi-Message Single-Chip Voice Record & Playback Devices |
|
| ISD17210PYI | WINBOND |
获取价格 |
Multi-Message Single-Chip Voice Record & Playback Devices |
|
| ISD17210PYI01 | WINBOND |
获取价格 |
Multi-Message Single-Chip Voice Record & Playback Devices |
|
| ISD17210PYIR | WINBOND |
获取价格 |
Multi-Message Single-Chip Voice Record & Playback Devices |
|
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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