是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | DIP |
包装说明: | 0.300 INCH, PLASTIC, DIP-8 | 针数: | 8 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.51 | 风险等级: | 5.92 |
最大时钟频率 (fCLK): | 2.1 MHz | JESD-30 代码: | R-PDIP-T8 |
JESD-609代码: | e0 | 长度: | 9.3218 mm |
内存密度: | 262144 bit | 内存集成电路类型: | EEPROM |
内存宽度: | 8 | 湿度敏感等级: | 3 |
功能数量: | 1 | 端子数量: | 8 |
字数: | 32768 words | 字数代码: | 32000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 32KX8 | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | DIP |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE |
并行/串行: | SERIAL | 峰值回流温度(摄氏度): | NOT SPECIFIED |
认证状态: | Not Qualified | 座面最大高度: | 4.572 mm |
串行总线类型: | SPI | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 2.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 7.62 mm | 最长写入周期时间 (tWC): | 10 ms |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
IS25C256-3PA3 | ISSI |
获取价格 |
128K-bit/ 256K-bit SPI SERIAL ELECTRICALLY ERASABLE PROM | |
IS25C256-3PI | ISSI |
获取价格 |
EEPROM, 32KX8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | |
IS25C256-3PLA3 | ISSI |
获取价格 |
128K-bit/ 256K-bit SPI SERIAL ELECTRICALLY ERASABLE PROM | |
IS25C256-3WA3 | ISSI |
获取价格 |
128K-bit/ 256K-bit SPI SERIAL ELECTRICALLY ERASABLE PROM | |
IS25C256-3WLA3 | ISSI |
获取价格 |
128K-bit/ 256K-bit SPI SERIAL ELECTRICALLY ERASABLE PROM | |
IS25C256-3ZI | ISSI |
获取价格 |
EEPROM, 32KX8, Serial, CMOS, PDSO8, TSSOP-8 | |
IS25C32-2G | ISSI |
获取价格 |
EEPROM, 4KX8, Serial, CMOS, PDSO8, SOIC-8 | |
IS25C32-2GI | ISSI |
获取价格 |
EEPROM, 4KX8, Serial, CMOS, PDSO8, SOIC-8 | |
IS25C32-2TI | ISSI |
获取价格 |
EEPROM, 4KX8, Serial, CMOS, PDSO14, TSSOP-14 | |
IS25C32-2ZI | ISSI |
获取价格 |
EEPROM, 4KX8, Serial, CMOS, PDSO14, TSSOP-14 |