Datasheet > IS2021S-002-TRAY

IS2021S-002-TRAY

更新时间： 2024-11-25 07:40:23

品牌	Logo	应用领域
美国微芯 - MICROCHIP		/
页数	文件大小	规格书
57页	2730K
描述
Telecom Circuit, 1-Func, CMOS

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中文翻译

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数据手册

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IS2021S-002-TRAY 数据手册

IS2020/21/23/25 SoC

Bluetooth 4.1 Stereo Audio SOC

 Packet loss concealment

Features

 Build-in four languages (Chinese/ English/

System Specification

 Compliant with Bluetooth Specification v.4.1

(EDR) in 2.4 GHz ISM band

 It supports following profiles :

- HFP 1.6

Spanish/ French) voice prompts and 20 events

for each one (This function can be set up in

“IS20XXS_UI” tool.)

 Support SCMS-T

- HSP 1.1

Audio Codec

- A2DP 1.2

- AVRCP 1.5

- SPP 1.0

- PBAP 1.0

 20 bit DAC and 16 bit ADC codec

 98dB SNR DAC playback

 Built-in 2 channel 2.3W class-D amplifier for a

4Ω speaker (for IS2025S only)

Baseband Hardware

 16MHz main clock input

Peripherals

 Built-in internal ROM for program memory

 Built-in Lithium-ion battery charger (up to

350mA)

 Support to connect to two hosts ( phones,

tablets…) with HFP or A2DP profiles

simultaneously

 Integrate 3V, 1.8V configurable switching

regulator and LDO

 Adaptive Frequency Hopping (AFH) avoids

occupied RF channels

 Built-in ADC for battery monitor and voltage

sense.

 Fast Connection supported

 A line-in port for external audio input

 Two LED drivers

RF Hardware

 Fully Bluetooth 4.1 (EDR) system in 2.4 GHz

ISM band.

Flexible HCI interface

 High speed HCI-UART (Universal

Asynchronous Receiver Transmitter) interface

(up to 921600bps)

 Combined TX/RX RF terminal simplifies

external matching and reduces external

antenna switches.

 Max. +4dBm output power with 20 dB level

control from register control.

Package

 5x6.5mm²48QFN package (IS2021S)

 7x7mm²56QFN package (IS2020S, IS2023S)

 8x8mm²68QFN package (IS2025S)

 Built-in T/R switch for Class 2/3 application

 To avoid temperature variation, temperature

sensor with temperature calibration is utilized

into bias current and gain control.

 Fully integrated synthesizer has been created.

There requires no external VCO, varactor

diode, resonator and loop filter.

 Crystal oscillation with built-in digital trimming

for temperature/process variations.

Description

Stereo Audio Chip is a compact, highly

integrated, CMOS single-chip RF and

baseband IC for Bluetooth v4.1 with Enhanced

Data Rate 2.4GHz applications. This chip is

fully compliant with Bluetooth specification and

completely backward-compatible with Bluetooth

3.0, 2.0 or 1.2 systems.

Audio processor

 Support 64 kb/s A-Law or -Law PCM format,

or CVSD (Continuous Variable Slope Delta

Modulation) for SCO channel operation.

It incorporates Bluetooth 1M/2M/3Mbps RF,

single-cycle 8bit MCU, TX/RX modem, 5-port

memory controller, task/hopping controller,

 Noise suppression

 Echo suppression

 SBC and optional AAC decoding

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中文翻译

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与IS2021S-002-TRAY相关器件

型号	品牌	获取价格	描述	数据表
IS2023S	ETC	获取价格	BluetoothÂ® 4.1 Stereo Audio SOC
IS2023S-203	MICROCHIP	获取价格	SPECIALTY TELECOM CIRCUIT
IS2023S-203-TRAY	MICROCHIP	获取价格	Telecom Circuit, 1-Func, CMOS
IS2025S	ETC	获取价格	BluetoothÂ® 4.1 Stereo Audio SOC
IS202G	ISOCOM	获取价格	Transistor Output Optocoupler, 1-Element, 5300V Isolation, PLASTIC, DIP-6
IS202-G	ISOCOM	获取价格	Optocoupler - Transistor Output, 1 CHANNEL TRANSISTOR OUTPUT OPTOCOUPLER, PLASTIC, DIP-6
IS202-SM	ISOCOM	获取价格	Optocoupler - Transistor Output, 1 CHANNEL TRANSISTOR OUTPUT OPTOCOUPLER, SURFACE MOUNT, P
IS202SMT&R	ISOCOM	获取价格	Transistor Output Optocoupler, 1-Element, 5300V Isolation, SURFACE MOUNT, PLASTIC PACKAGE-
IS202X	ISOCOM	获取价格	Transistor Output Optocoupler, 1-Element, 5300V Isolation, PLASTIC, DIP-6
IS202XG	ISOCOM	获取价格	Transistor Output Optocoupler, 1-Element, 5300V Isolation, PLASTIC, DIP-6

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