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IS2023S-203 PDF预览

IS2023S-203

更新时间: 2023-12-18 00:00:00
品牌 Logo 应用领域
美国微芯 - MICROCHIP 电信电信集成电路
页数 文件大小 规格书
57页 2730K
描述
SPECIALTY TELECOM CIRCUIT

IS2023S-203 技术参数

生命周期:Active包装说明:QFN-56
Reach Compliance Code:compliant风险等级:5.68
JESD-30 代码:S-XQCC-N56长度:7 mm
功能数量:1端子数量:56
最高工作温度:70 °C最低工作温度:-20 °C
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
座面最大高度:0.9 mm标称供电电压:1.2 V
表面贴装:YES技术:CMOS
电信集成电路类型:TELECOM CIRCUIT温度等级:OTHER
端子形式:NO LEAD端子节距:0.4 mm
端子位置:QUAD宽度:7 mm
Base Number Matches:1

IS2023S-203 数据手册

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IS2020/21/23/25 SoC  
®
Bluetooth 4.1 Stereo Audio SOC  
Packet loss concealment  
Features  
Build-in four languages (Chinese/ English/  
System Specification  
Compliant with Bluetooth Specification v.4.1  
(EDR) in 2.4 GHz ISM band  
It supports following profiles :  
- HFP 1.6  
Spanish/ French) voice prompts and 20 events  
for each one (This function can be set up in  
IS20XXS_UItool.)  
Support SCMS-T  
- HSP 1.1  
Audio Codec  
- A2DP 1.2  
- AVRCP 1.5  
- SPP 1.0  
- PBAP 1.0  
20 bit DAC and 16 bit ADC codec  
98dB SNR DAC playback  
Built-in 2 channel 2.3W class-D amplifier for a  
4Ω speaker (for IS2025S only)  
Baseband Hardware  
16MHz main clock input  
Peripherals  
Built-in internal ROM for program memory  
Built-in Lithium-ion battery charger (up to  
350mA)  
Support to connect to two hosts ( phones,  
tablets…) with HFP or A2DP profiles  
simultaneously  
Integrate 3V, 1.8V configurable switching  
regulator and LDO  
Adaptive Frequency Hopping (AFH) avoids  
occupied RF channels  
Built-in ADC for battery monitor and voltage  
sense.  
Fast Connection supported  
A line-in port for external audio input  
Two LED drivers  
RF Hardware  
Fully Bluetooth 4.1 (EDR) system in 2.4 GHz  
ISM band.  
Flexible HCI interface  
High speed HCI-UART (Universal  
Asynchronous Receiver Transmitter) interface  
(up to 921600bps)  
Combined TX/RX RF terminal simplifies  
external matching and reduces external  
antenna switches.  
Max. +4dBm output power with 20 dB level  
control from register control.  
Package  
5x6.5mm2 48QFN package (IS2021S)  
7x7mm2 56QFN package (IS2020S, IS2023S)  
8x8mm2 68QFN package (IS2025S)  
Built-in T/R switch for Class 2/3 application  
To avoid temperature variation, temperature  
sensor with temperature calibration is utilized  
into bias current and gain control.  
Fully integrated synthesizer has been created.  
There requires no external VCO, varactor  
diode, resonator and loop filter.  
Crystal oscillation with built-in digital trimming  
for temperature/process variations.  
Description  
Stereo Audio Chip is a compact, highly  
integrated, CMOS single-chip RF and  
baseband IC for Bluetooth v4.1 with Enhanced  
Data Rate 2.4GHz applications. This chip is  
fully compliant with Bluetooth specification and  
completely backward-compatible with Bluetooth  
3.0, 2.0 or 1.2 systems.  
Audio processor  
Support 64 kb/s A-Law or -Law PCM format,  
or CVSD (Continuous Variable Slope Delta  
Modulation) for SCO channel operation.  
It incorporates Bluetooth 1M/2M/3Mbps RF,  
single-cycle 8bit MCU, TX/RX modem, 5-port  
memory controller, task/hopping controller,  
Noise suppression  
Echo suppression  
SBC and optional AAC decoding  
Page 1  

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