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IRL1404ZSTRRPBF PDF预览

IRL1404ZSTRRPBF

更新时间: 2024-11-24 13:08:55
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 125K
描述
Power Field-Effect Transistor, 75A I(D), 40V, 0.0031ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, LEAD FREE, PLASTIC, D2PAK-3

IRL1404ZSTRRPBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:LEAD FREE, PLASTIC, D2PAK-3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.09
其他特性:AVALANCHE RATED, HIGH RELIABILITY, LOGIC LEVEL COMPATIBLE, ULTRA-LOW RESISTANCE雪崩能效等级(Eas):220 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:40 V最大漏极电流 (Abs) (ID):200 A
最大漏极电流 (ID):75 A最大漏源导通电阻:0.0031 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):230 W最大脉冲漏极电流 (IDM):790 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:MATTE TIN OVER NICKEL
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRL1404ZSTRRPBF 数据手册

 浏览型号IRL1404ZSTRRPBF的Datasheet PDF文件第2页浏览型号IRL1404ZSTRRPBF的Datasheet PDF文件第3页浏览型号IRL1404ZSTRRPBF的Datasheet PDF文件第4页浏览型号IRL1404ZSTRRPBF的Datasheet PDF文件第5页浏览型号IRL1404ZSTRRPBF的Datasheet PDF文件第6页浏览型号IRL1404ZSTRRPBF的Datasheet PDF文件第7页 
PD - 93854B  
IRL1404  
HEXFET® Power MOSFET  
l Advanced Process Technology  
l Ultra Low On-Resistance  
l Dynamic dv/dt Rating  
D
VDSS = 40V  
l 175°C Operating Temperature  
l Fast Switching  
RDS(on) = 4.0mΩ  
G
l Fully Avalanche Rated  
ID = 160A†  
S
Description  
Seventh Generation HEXFET® power MOSFETs from International  
Rectifier utilize advanced processing techniques to achieve extremely  
low on-resistance per silicon area. This benefit, combined with the fast  
switching speed and ruggedized device design that HEXFET power  
MOSFETs are well known for, provides the designer with an extremely  
efficient and reliable device for use in a wide variety of applications.  
The TO-220 package is universally preferred for all commercial-industrial  
applications at power dissipation levels to approximately 50 watts. The  
low thermal resistance and low package cost of the TO-220 contribute to  
its wide acceptance throughout the industry.  
TO-220AB  
Absolute Maximum Ratings  
Parameter  
Max.  
160†  
110†  
640  
200  
1.3  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
A
PD @TC = 25°C  
Power Dissipation  
W
W/°C  
V
Linear Derating Factor  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
± 20  
620  
95  
Single Pulse Avalanche Energy‚  
Avalanche Current  
mJ  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
20  
mJ  
V/ns  
5.0  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 srew  
°C  
300 (1.6mm from case)  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
Units  
RθJC  
RθCS  
RθJA  
Junction-to-Case  
0.75  
–––  
62  
Case-to-Sink, Flat, Greased Surface  
0.50  
–––  
°C/W  
Junction-to-Ambient (PCB Mounted)‡  
www.irf.com  
1
06/14/04  

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