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IRFI9Z24N PDF预览

IRFI9Z24N

更新时间: 2024-11-04 22:26:27
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 121K
描述
HEXFET Power MOSFET

IRFI9Z24N 数据手册

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PD - 9.1529A  
IRFI9Z24N  
HEXFET® Power MOSFET  
l Advanced Process Technology  
l Isolated Package  
D
VDSS = -55V  
l High Voltage Isolation = 2.5KVRMS  
l Sink to Lead Creepage Dist. = 4.8mm  
l P-Channel  
RDS(on) = 0.175Ω  
G
l Fully Avalanche Rated  
Description  
ID = -9.5A  
S
FifthGenerationHEXFETsfromInternationalRectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This  
benefit, combined with the fast switching speed and  
ruggedized device design that HEXFET Power  
MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use  
in a wide variety of applications.  
TheTO-220Fullpakeliminatestheneedforadditional  
insulating hardware in commercial-industrial  
applications. Themouldingcompoundusedprovides  
ahighisolationcapabilityandalowthermalresistance  
between the tab and external heatsink. This isolation  
is equivalent to using a 100 micron mica barrier with  
standard TO-220 product. The Fullpak is mounted to  
a heatsink using a single clip or by a single screw  
fixing.  
TO-220 FULLPAK  
Absolute Maximum Ratings  
Parameter  
Max.  
- 9.5  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ -10V  
Continuous Drain Current, VGS @ -10V  
Pulsed Drain Current †  
- 6.7  
A
- 48  
PD @TC = 25°C  
Power Dissipation  
29  
W
W/°C  
V
Linear Derating Factor  
0.19  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
± 20  
Single Pulse Avalanche Energy‚†  
Avalanche Current†  
96  
mJ  
-7.2  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ†  
Operating Junction and  
2.9  
mJ  
- 5.0  
-55 to + 175  
V/ns  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 screw  
°C  
300 (1.6mm from case )  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Junction-to-Ambient  
Typ.  
–––  
Max.  
5.2  
65  
Units  
RθJC  
RθJA  
°C/W  
–––  
8/25/97  

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