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IRF6156PBF PDF预览

IRF6156PBF

更新时间: 2024-11-12 13:08:47
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关
页数 文件大小 规格书
13页 248K
描述
Power Field-Effect Transistor, 20V, 0.04ohm, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, FLIPFET-6

IRF6156PBF 技术参数

是否Rohs认证:符合生命周期:Obsolete
包装说明:GRID ARRAY, R-PBGA-B6Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.35
Is Samacsys:N配置:COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏源导通电阻:0.04 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PBGA-B6
元件数量:2端子数量:6
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:GRID ARRAY峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):2.5 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子形式:BALL
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRF6156PBF 数据手册

 浏览型号IRF6156PBF的Datasheet PDF文件第2页浏览型号IRF6156PBF的Datasheet PDF文件第3页浏览型号IRF6156PBF的Datasheet PDF文件第4页浏览型号IRF6156PBF的Datasheet PDF文件第5页浏览型号IRF6156PBF的Datasheet PDF文件第6页浏览型号IRF6156PBF的Datasheet PDF文件第7页 
PD - 94592A  
IRF6156  
l Ultra Low RSS(on) per Footprint Area  
FlipFETPower MOSFET  
l Low Thermal Resistance  
l Bi-Directional N-Channel Switch  
l Super Low Profile (<.8mm)  
l Available Tested on Tape & Reel  
VSS  
20V  
RSS(on) max  
40m @VGS1,2 = 4.5V  
IS  
±6.5  
60m @VGS1,2 = 2.5V  
±5.2  
†
l ESD Protection Diode  
Description  
True chip-scale packaging is available from International Recti-  
fier. Through the use of advanced processing techniques and a  
unique packaging concept, extremely low on-resistance and the  
highestpowerdensitiesintheindustryhavebeenmadeavailable  
for battery and load management applications. These benefits,  
combined with the ruggedized device design that International  
Rectifier is well known for, provide the designer with an  
extremely efficient and reliable device.  
TheFlipFET™ package, isone-fifththefootprintofacomparable  
TSSOP-8 package and has a profile of less than .8mm. Com-  
bined with the low thermal resistance of the die level device, this  
makes the FlipFET™ the best device for applications where  
printed circuit board space is at a premium and in extremely thin  
application environments such as battery packs, mobile phones  
and PCMCIA cards.  
Absolute Maximum Ratings  
Parameter  
Max.  
20  
Units  
VSS  
Source-to-Source Voltage  
Continuous Current, VGS1 = VGS2 = 4.5V  
Continuous Current, VGS1 = VGS2 = 4.5V  
Pulsed Current  
V
IS @ TA = 25°C  
IS @ TA = 70°C  
ISM  
±6.5  
±5.2  
33  
A
Power Dissipation  
P
P
@TA = 25°C  
@TA = 70°C  
2.5  
W
D
D
Power Dissipation  
1.6  
Linear Derating Factor  
Gate-to-Source Voltage  
20  
mW/°C  
V
V
T
±12  
GS  
Operating Junction and  
-55 to + 150  
°C  
J
T
Storage Temperature Range  
STG  
Thermal Resistance  
Parameter  
Junction-to-Ambient  
Typ.  
–––  
35  
Max.  
50  
Units  
RθJA  
°C/W  
RθJ-PCB  
Junction-to-PCB  
–––  
www.irf.com  
1
09/25/03  

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