F-209-1
IPT1–110–01–S–D
IPS1–120–01–S–D–RA
IPS1–120–01–S–D–VS
®
IPT1,
MINI MATE CONNECTOR SETIPS1
SPECIFICATIONS
For complete specifications
see www.samtec.com?IPT1 or
www.samtec.com?IPS1
LEAD
STYLE
PLATING
OPTION
TAIL
OPTION
OTHER
OPTION
NO. PINS
PER ROW
IPT1
1
D
Insulator Material: Black LCP
Contact Material:
Mates with: IPS1
Specify
LEAD
STYLE
from
–S
–K
Phosphor Bronze
= 30µ" (0,76µm)
Gold on contact,
Matte Tin on Tail
Requires –01
= (6,00mm)
.236" DIA
Plating:
Lead Style
(Leave blank for
Through-Hole)
Sn or Au over 50µ" (1,27µm) Ni
Operating Temp Range:
-55°C to +105°C with Tin;
-55°C to +125°C with Gold
Insertion Depth: (3,71mm)
.146" to (6,48mm) .255"
Wiping Distance:
05, 10, 15, 20, 25
Polyimide film
Pick & Place Pad
(–VS only)
(Call Samtec for other sizes)
chart
No. of positions
x (2,54) .100
+ (0,51) .020
LEAD
STYLE
–RA
A
B
C
= Right Angle
–LC
50
(11,05) (5,84) (2,16)
.435 .250 .085
02
01
02
= Locking Clip
(–VS only)
–01
(0,38mm) .015"
–VS
(13,59) (5,84)
Insertion Force (SMT):
3.0oz (0,83N) avg.
(5,08)
.200
N/A
-01-VS
–02
(N/A with -A)
.535 .250
= Surface Mount
(14,00) (9,30) (2,64)
.551 .366 .104
Withdrawal Force (SMT):
2.6oz (0,72N) avg.
01
(2,54)
.100
(2,54)
.100
–A
–POL
(2,30)
.090
49
(16,00) (11,30) (2,16)
.630 .445 .085
Insertion Force (T/H):
6.0oz (1,67N) avg.
–03
= Alignment Pin
(–VS only) (N/A
with -LC)
Surface
Mount
Through-
hole
(17,00) (12,30) (2,69)
.669 .484 .106
(7,16)
.282
–04
Withdrawal Force (T/H):
5.0oz (1,39N) avg.
(1,50)
.060
(19,00) (14,30) (2,46)
.748 .563 .097
–05
Voltage Rating: 550 VAC
RoHS Compliant: Yes
(1,27)
.050
(20,00) (15,30) (2,35)
.787 .602 .093
–POL
= No. 1 position
polarized
–06
CURRENT RATING
(25,00) (20,30) (2,31)
.984 .799 .091
(30,00) (25,30) (2,39)
1.181 .996 .094
B
C
–07
–08
AMBIENT
IPT1/IPS1
TEMP
(2,54) .100
(0,51)
.020
–VS
8A
7.2A
6A
20°C
40°C
60°C
95°C
–RA
(35,00) (30,30) (2,46)
1.378 1.193 .097
–09
(0,64) .025 SQ
4.1A
6 POSITIONS (2x3)
APPLICATION
NO. PINS
PER ROW
PLATING
OPTION
TAIL
OPTION
OTHER
OPTION
POL
OPTION
IPS1
01
1
SPECIFIC OPTION
D
Latching feature available.
Call Samtec.
Mates with: IPT1
Leave
blank for
Through-
hole
APPLICATION
–K
–POL
= No. 1
position
polarized
= (5,50mm)
.217" DIA
Polyimide
film Pick &
Place Pad
(–VS only)
–S
= 30µ" (0,76µm)
Gold on contact,
Matte Tin on Tail
IPS1
05, 10, 15, 20, 25
A
(Call Samtec for other sizes)
= Board
Stack
–VS
= Surface
Mount
–TR
= Tape &
Reel
Height
No. of positions x (2,54) .100 + (0,38) .015
Mated
IPT1
02
01
with IPS1
50
49
02
01
–LC
= Locking
Clip
Packaging
–RA
= Right
Angle
(4,95)
.195
Processing:
(–VS only)
(2,54)
.100
(2,54)
.100
Max Processing Temp:
–POL
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable: Yes
SMT Lead Coplanarity:
(0,13mm) .005" max (05-10)
(0,15mm) .006" max (15-25)
(3,81)
.150
(8,51)
.335
(2,54)
.100
(1,27)
.050
(2,54)
.100
Note: Other Gold plating
options available.
Contact Samtec.
(7,87) .310
(0,51)
.020
(0,41) .016
(0,79) .031
Surface Mount
Note:
–VS
(2,54)
.100
Some sizes, styles and
options are non-standard,
non-returnable.
Through-hole
–RA
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