IMP690A, 692A, 802L, 802M, 805L
Pin Description
Pin Number
IMP690A/IMP692A
IMP802L/IMP802M
IMP805L
Name
Function
1
1
VOUT
Voltage supply for RAM. When VCC is above the reset threshold, VOUT
connects to VCC through a P-channel MOS device. If VCC falls below the
reset threshold, this output will be connected to the backup supply at
VBATT (or VCC, whichever is higher) through the MOS switch to provide
continuous power to the CMOS RAM.
+5V power supply input
Ground
2
3
4
2
3
4
VCC
GND
PFI
Power failure monitor input. PFI is connected to the internal power fail
comparator which is referenced to 1.25V. The power fail output (PFO)
is active LOW but remains HIGH if PFI is above 1.25V. If this feature is
unused, the PFI pin should be connected to GND or VOUT
.
5
6
5
6
PFO
WDI
Power-fail output. PFO is active LOW whenever the PFI pin is less than
1.25V.
Watchdog input. The WDI input monitors microprocessor activity. An
internal timer is reset with each transition of the WDI input. If WDI is held
HIGH or LOW for longer than the watchdog timeout period, typically 1.6
seconds, RESET (or RESET) is asserted for the reset pulse width time,
tRS, of 140ms, minimum.
7
––––
RESET
Active-LOW reset output. When triggered by VCC falling below the reset
threshold or by watchdog timer timeout, RESET (or RESET) pulses low
for the reset pulse width, tRS, typically 200ms. It will remain low if VCC is
below the reset threshold (4.65V in the IMP690A/IMP802L and 4.4V in
the IMP692A/IMP802L) and remains low for 200ms after VCC rise above
the reset threshold.
––––
8
7
8
RESET
VBATT
Active-HIGH reset output. The inverse of RESET.
Auxiliary power or backup-battery input. VBATT should be connected to
GND if the function is not used. This input has about 40mV of hysteresis
to prevent rapid toggling between VCC and VBATT
.
Absolute Maximum Ratings
Continuous Power Dissipation
Pin Terminal Voltage with Respect to Ground
Plastic DIP (derate 9mW/°C above 70°C) . . . 800mW
SO (derate 5.9mW/°C above 70°C) . . . . . . . . 500mW
CerDIP (derate 8mW/°C above 70°C) . . . . . . 650mW
Operating Temperature Range (C Devices) . . . . 0°C to 70°C
Operating Temperature Range (E Devices) . . . . –40°C to 85°C
Storage Temperature Range . . . . . . . . . . . . . . . . . –65°C to 160°C
Lead Temperature Soldering, (10 sec) . . . . . . . . 300°C
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to 6.0V
VBATT . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to 6.0V
All Other Inputs* . . . . . . . . . . . . . . . . . . . –0.3V to (VCC + 0.3V)
Input Current at VCC . . . . . . . . . . . . . . . . . . 200mA
Input Current at VBATT . . . . . . . . . . . . . . . . . 50mA
Input Current at GND . . . . . . . . . . . . . . . . . 20mA
Output Current:
VOUT . . . . . . . . . . . . . . . Short circuit protected
All Other Inputs . . . . . . . . . . . . . . . . . . . 20mA
Rate of Rise: VBATT and VCC . . . . . . . . . . 100V/µs
* The input voltage limits on PFI and WDI may be exceeded if the
current is limited to less than 10mA
These are stress ratings only and functional operation is not implied.
Exposure to absolute maximum ratings for prolonged time periods may
affect device reliability.
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