Datasheet > ILCX09-GI2F18-20.000

ILCX09-GI2F18-20.000

更新时间： 2024-10-28 11:19:47

品牌	Logo	应用领域
ILSI		晶体石英晶体
页数	文件大小	规格书
2页	48K
描述
2 Pad Ceramic Package Quartz Crystal, 3.5 mm x 6 mm

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ILCX09-GI2F18-20.000 数据手册

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2 Pad Ceramic Package Quartz Crystal, 3.5 mm x 6 mm

ILCX09 Series

Pb Free Solder Reflow Profile:

Typical Circuit:

*Units are backward compatible with 240C reflow processes

Package Information:

MSL = 1

Termination = e4 (Au over Ni over W base metal).

Tape and Reel Information:

Quantity per

1000

Reel

16 +/-.3

8 +/-.2

7.5 +/-.2

17.5 +/-1

50 / 60 / 80

180 / 250

Environmental Specifications

Thermal Shock

MIL-STD-883, Method 1011, Condition A

MIL-STD-883, Method 1004

MIL-STD-883, Method 2002, Condition B

MIL-STD-883, Method 2007, Condition A

J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)

Pb-Free / RoHS / Green Compliant

JESD22-B102-D Method 2 (Preconditioning E)

MIL-STD-883, Method 2004, Test Condition D

MIL-STD-883, Method 1014, Condition C

Moisture Resistance

Mechanical Shock

Mechanical Vibration

Resistance to Soldering Heat

Hazardous Substance

Solderability

Terminal Strength

Gross Leak

Fine Leak

Solvent Resistance

MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s

MIL-STD-202, Method 215

Marking

Line 1: ILSI, Date Code (yww)

Line 2: Frequency

ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com

06/09_A

Specifications subject to change without notice

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