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ILCX05-FF3318-20.000 PDF预览

ILCX05-FF3318-20.000

更新时间: 2024-10-28 12:08:27
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ILSI /
页数 文件大小 规格书
2页 53K
描述
4 Pad Ceramic Package, 5.5 mm x 11.9 mm

ILCX05-FF3318-20.000 数据手册

 浏览型号ILCX05-FF3318-20.000的Datasheet PDF文件第1页 
4 Pad Ceramic Package, 5.5 mm x 11.9 mm  
ILCX05 Series  
Pb Free Solder Reflow Profile:  
Typical Circuit:  
*Units are backward compatible with 240C reflow processes  
Package Information:  
MSL = 2a  
Termination = e4 (Au over Ni over W base metal).  
Tape and Reel Information:  
Quantity per  
1000  
Reel  
A
B
C
D
E
F
24 +/-.3  
12+/-.2  
11.5 +/-.2  
25 +/-1.5  
80 / 100  
330  
Environmental Specifications  
Thermal Shock  
MIL-STD-883, Method 1011, Condition A  
Moisture Resistance  
Mechanical Shock  
Mechanical Vibration  
Resistance to Soldering Heat  
Hazardous Substance  
Solderability  
MIL-STD-883, Method 1004  
MIL-STD-883, Method 2002, Condition B  
MIL-STD-883, Method 2007, Condition A  
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)  
Pb-Free / RoHS / Green Compliant  
JESD22-B102-D Method 2 (Preconditioning E)  
MIL-STD-883, Method 2004, Test Condition D  
MIL-STD-883, Method 1014, Condition C  
Terminal Strength  
Gross Leak  
Fine Leak  
Solvent Resistance  
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s  
MIL-STD-202, Method 215  
Marking  
Line 1: ILSI, Date Code (YWW)  
Line 2: Frequency  
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com  
06/09_A  
Specifications subject to change without notice  
Page 2  

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