IFR3000™/IFT3000™ Rx IF/BASEBAND
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Q U A L C O M M C D M A T E C H N O L O G I E S
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E N A B L I N G T H E F U T U R E O F C O M M U N I C A T I O N S
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IFT3000
IFR3000 and IFT3000 Devices as Part of QUALCOMM’s Fifth-Generation Chipset Dual-Mode Cellular (CDMA/AMPS) Handset Architecture
Overview
telephones. The IFR3000 and IFT3000 devices interface between the
radio-frequency (RF) section and the digital processing circuitry of the
telephone.
The QUALCOMM IFR3000™ and IFT3000™ Rx and Tx IF/Baseband
processors offer significant reduction in cost, size and pin count over
previous generation products. By integrating the functionality of three
Application Specific Integrated Circuits (ASICs) into two ASICs,
designers now possess IF-to-Baseband and Baseband-to-IF processing
power, and Rx and Tx Automatic Gain Control (AGC) circuitry on either
two 48-pin Low-profile Quad Flat Pack (LQFP) packages or two 48-pin
Bump Chip Carrier (BCC) packages.
Smaller Packaging
The IFR3000 and IFT3000 devices incorporate all the Rx and Tx
processing capability of the QUALCOMM Q5312 Analog Baseband
Processor (BBA2-shrink) together with the automatic gain control
functionality of the QUALCOMM Q5500™ Rx and Q5505™ Tx AGC
amplifiers. The result is a more economic, two-chip analog baseband
solution which provides handset designers over a 60% reduction
in size.
The IFR3000 and IFT3000 Rx and Tx IF/Baseband processors are
designed for use in dual-mode CDMA and FM portable cellular
IFR3000
IFR3000
48-pin BCC
(7mm x 7mm)
48-lead TQFP
(9mm x 9mm)
Q5312
(BBA2-shrink)
80-lead TQFP
(14mm x 14mm)
IFT3000
IFT3000
48-pin BCC
(7mm x 7mm)
48-lead TQFP
(9mm x 9mm)
Q5500
Q5505
(6x5 mm)
(6x5 mm)
48-lead TQFP
(162 mm2)
48-pin BCC
(98 mm2)
BBA2-shrink / AGC Amps
(256 mm2)
IFR3000 and IFT3000
Substantial Board Real Estate Savings
QUALCOMM INCORPORATED
CDMA TECHNOLOGIES
5775 MOREHOUSE DRIVE SAN DIEGO, CA 92121
http://www.cdmatech.com/about_us/contact.jsp