3.3 VOLT CMOS SyncFIFOTM
256 x 18, 512 x 18, 1,024 x 18,
2,048 x 18, and 4,096 x 18
IDT72V205, IDT72V215,
IDT72V225, IDT72V235,
IDT72V245
FEATURES:
DESCRIPTION:
• 256 x 18-bit organization array (IDT72V205)
• 512 x 18-bit organization array (IDT72V215)
• 1,024 x 18-bit organization array (IDT72V225)
• 2,048 x 18-bit organization array (IDT72V235)
• 4,096 x 18-bit organization array (IDT72V245)
• 10 ns read/write cycle time
TheIDT72V205/72V215/72V225/72V235/72V245arefunctionallycom-
patibleversionsoftheIDT72205LB/72215LB/72225LB/72235LB/72245LB,
designed to run off a 3.3V supply for exceptionally low power consumption.
These devices are very high-speed, low-power First-In, First-Out (FIFO)
memorieswithclockedreadandwritecontrols. TheseFIFOsareapplicable
forawidevarietyofdatabufferingneeds,suchasopticaldiskcontrollers,Local
AreaNetworks(LANs),andinterprocessorcommunication.
• 5V input tolerant
• IDT Standard or First Word Fall Through timing
• Single or double register-buffered Empty and Full flags
• Easily expandable in depth and width
• Asynchronous or coincident Read and Write Clocks
• Asynchronous or synchronous programmable Almost-Empty
and Almost-Full flags with default settings
• Half-Full flag capability
• Output enable puts output data bus in high-impedanc state
• High-performance submicron CMOS technology
• Available in a 64-lead thin quad flatpack (TQFP/STQFP)
• Industrial temperature range (–40°C to +85°C) is available
TheseFIFOshave18-bitinputandoutputports. Theinputportiscontrolled
byafree-runningclock(WCLK),andaninputenablepin(WEN).Dataisread
intothesynchronousFIFOoneveryclockwhenWENisasserted.Theoutput
portiscontrolledbyanotherclockpin(RCLK)andanotherenablepin(REN).
TheReadClock(RCLK)canbetiedtotheWriteClockforsingleclockoperation
orthetwoclockscanrunasynchronousofoneanotherfordual-clockoperation.
AnOutputEnablepin(OE)isprovidedonthereadportforthree-statecontrol
oftheoutput.
ThesynchronousFIFOshavetwofixedflags,EmptyFlag/OutputReady
(EF/OR) and Full Flag/Input Ready (FF/IR), and two programmable flags,
Almost-Empty(PAE)andAlmost-Full(PAF). Theoffsetloadingoftheprogram-
FUNCTIONAL BLOCK DIAGRAM
WCLK
D0-D17
LD
WEN
INPUT REGISTER
OFFSET REGISTER
FF/IR
PAF
FLAG
WRITE CONTROL
LOGIC
EF/OR
PAE
LOGIC
RAM ARRAY
256 x 18, 512 x 18
1,024 x 18, 2,048 x 18
4,096 x 18
HF/(WXO)
READ POINTER
WRITE POINTER
FL
WXI
READ CONTROL
LOGIC
EXPANSION LOGIC
(HF)/WXO
RXI
RXO
OUTPUT REGISTER
RESET LOGIC
RS
4294 drw 01
OE
REN
RCLK
Q0-Q17
IDTandtheIDTlogoareregisteredtrademarksofIntegratedDeviceTechnology,Inc.SyncFIFOisatrademarkofIntegratedDeviceTechnology,Inc.
FEBRUARY 2002
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
2002 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
DSC-4294/3