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256K x 36, 512K x 18
IDT71V65703
IDT71V65903
3.3 V S ynchronou s Z BT ™ S RAMs
3.3V I/O, Burst Counter
Flow-Through Outputs
Features
256K x 36, 512K x 18 memory configurations
Address and control signals are applied to the SRAM during one
clock cycle, and on the next clock cycle the associated data cycle
occurs, be it read or write.
The IDT71V65703/5903 contain address, data-in and control
signal registers. The outputs are flow-through (no output data
register). Output enable is the only asynchronous signal and can be
used to disable the outputs at any given time.
A Clock Enable ( CEN ) pin allows operation of the IDT71V65703/5903
tobesuspendedaslongasnecessary.Allsynchronousinputsareignoredwhen
CEN is high and the internal device registers will hold their previous values.
There are three chip enable pins ( CE 1 , CE 2 , CE 2 ) that allow the
user to deselect the device when desired. If any one of these three
is not asserted when ADV/ LD is low, no new memory operation can
be initiated. However, any pending data transfers (reads or writes)
will be completed. The data bus will tri-state one cycle after the chip
is deselected or a write is initiated.
Supports high performance system speed - 100 MHz
(7.5 ns Clock-to-Data Access)
ZBT TM Feature - No dead cycles between write and read
cycles
Internally synchronized output buffer enable eliminates the
need to control OE
Single R/ W (READ/WRITE) control pin
4-word burst capability (Interleaved or linear)
Individual byte write ( BW 1 - BW 4 ) control (May tie active)
Three chip enables for simple depth expansion
3.3V power supply ( 5%)
3.3V ( 5%) I/O Supply (V DDQ )
Power down controlled by ZZ input
Packaged in a JEDEC standard 100-pin plastic thin quad
Th e I DT71V65703/590 3 h av e a n o n-chi p b urs t c ounter . I n t h e b urst
mode , t h e I DT71V65703/590 3 c a n p rovid e f ou r c ycle s o f d at a f o r a s ingle
address presented to the SRAM. The order of the burst sequence is
defined by the LBO input pin. The LBO pin selects between linear and
interleaved burst sequence. The ADV/ LD signal is used to load a new
externa l a ddres s ( ADV/ L D = L OW ) o r i ncremen t t h e i nterna l b urs t c ounter
(ADV/ LD = HIGH).
The IDT71V65703/5903 SRAMs utilize a high-performance CMOS
process and are packaged in a JEDEC Standard 14mm x 20mm 100-
pin plasti c t hi n q ua d f latpac k ( TQFP), 119 bal l g ri d a rra y ( BGA) and a 165
fine pitch ball grid array (fBGA).
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch
ball grid array (fBGA)
Green parts available, see ordering information
Description
The IDT71V65703/5903 are 3.3V high-speed 9,437,184-bit
(9 Megabit) synchronous SRAMs organized as 256K x 36 / 512K x 18.
They are designed to eliminate dead bus cycles when turning the bus
aroun d b etwee n r ead s a n d w rites, o r w rite s a n d r eads. Thu s t he y h ave
been given the name ZBT TM , or Zero Bus Turnaround.
Pin Description Summary
A
0
- A 1 8
Address I n p u t s
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
I / O
Synchronous
Synchronous
Asynchronous
Synchronous
Synchronous
Synchronous
N/A
Chip Enables
CE , CE
1
2 , CE 2
Output Enable
OE
R/ W
R e ad/Write Sign a l
Clock Enable
CEN
BW , BW
CLK
Individual By t e Write Selects
Clock
1
2 , BW 3 , BW 4
A D V / LD
Advance Burst Address/Load New Address
Linear/Interleaved Burst Order
Sleep Mode
Synchronous
S t atic
LBO
ZZ
Asynchronous
Synchronous
S t atic
I / O
0 - I / O 3 1 , I / O P1 - I / O P4
Data Input/Output
Core Power, I/O Power
Gro u nd
V
V
DD , V DDQ
SS
Supply
Supply
S t atic
5298 tbl 01
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola, Inc.
OCTOBER 2014
1
©2014 Integrated Device Technology, Inc.
DSC-5298/05