IDT71V3556S
IDT71V3558S
IDT71V3556SA
IDT71V3558SA
128K x 36, 256K x 18
3.3VSynchronousZBTSRAMs
3.3V I/O, Burst Counter
PipelinedOutputs
Description
Features
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TheIDT71V3556/58are3.3Vhigh-speed4,718,592-bit(4.5Mega-
bit) synchronous SRAMS. They are designed to eliminate dead bus
cycles when turning the bus around between reads and writes, or
writes and reads. Thus, they have been given the name ZBTTM, or
Zero Bus Turnaround.
128K x 36, 256K x 18 memory configurations
◆
Supports high performance system speed - 200 MHz
(3.2 ns Clock-to-Data Access)
ZBTTM Feature - No dead cycles between write and read
◆
cycles
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Address and control signals are applied to the SRAM during one
clockcycle,andtwocycleslatertheassociateddatacycleoccurs,beit
read or write.
The IDT71V3556/58 contain data I/O, address and control signal
registers.Outputenableistheonlyasynchronoussignalandcanbeused
todisabletheoutputsatanygiventime.
A Clock Enable (CEN) pin allows operation of the IDT71V3556/58
to be suspended as long as necessary. All synchronous inputs are
ignored when (CEN) is high and the internal device registers will hold
their previous values.
Internally synchronized output buffer enable eliminates the
need to control OE
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Single R/W (READ/WRITE) control pin
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Positive clock-edge triggered address, data, and control
signal registers for fully pipelined applications
4-word burst capability (interleaved or linear)
Individual byte write (BW1 - BW4) control (May tie active)
Three chip enables for simple depth expansion
3.3V power supply (±5%), 3.3V I/O Supply (VDDQ)
Optional- Boundary Scan JTAG Interface (IEEE 1149.1
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Therearethreechipenablepins(CE1,CE2,CE2)thatallowtheuser
to deselect the device when desired. If any one of these three are not
asserted when ADV/LD is low, no new memory operation can be
initiated. However, anypendingdata transfers (reads orwrites)willbe
completed.Thedatabuswilltri-statetwocyclesafterchipisdeselected
orawriteisinitiated.
compliant)
◆
Packaged in a JEDEC standard 100-pin plastic thin quad
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch
ball grid array (fBGA)
PinDescriptionSummary
A0-A17
Address Inputs
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Output
Input
Input
I/O
Synchronous
Synchronous
Asynchronous
Synchronous
Synchronous
Synchronous
N/A
Chip Enables
CE1, CE2, CE2
Output Enable
OE
R/W
Read/Write Signal
Clock Enable
CEN
Individual Byte Write Selects
Clock
BW1, BW2, BW3, BW4
CLK
ADV/LD
LBO
Advance burst address / Load new address
Linear / Interleaved Burst Order
Test Mode Select
Test Data Input
Synchronous
Static
TMS
TDI
Synchronous
Synchronous
N/A
TCK
TDO
Test Clock
Test Data Output
Synchronous
Asynchronous
Synchronous
Synchronous
Static
JTAG Reset (Optional)
Sleep Mode
TRST
ZZ
I/O0-I/O31, I/OP1-I/OP4
VDD, VDDQ
Data Input / Output
Core Power, I/O Power
Ground
Supply
Supply
VSS
Static
5281 tbl 01
SEPTEMBER 2004
1
©2004IntegratedDeviceTechnology,Inc.
DSC-5281/08