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IDT71V3556XS PDF预览

IDT71V3556XS

更新时间: 2024-11-30 00:22:43
品牌 Logo 应用领域
艾迪悌 - IDT 静态存储器
页数 文件大小 规格书
25页 489K
描述
3.3V Synchronous ZBT SRAMs

IDT71V3556XS 数据手册

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IDT71V3556S/XS  
IDT71V3558S/XS  
IDT71V3556SA/XSA  
IDT71V3558SA/XSA  
128K x 36, 256K x 18  
3.3V Synchronous ZBT SRAMs  
3.3V I/O, Burst Counter  
Pipelined Outputs  
Description  
Features  
TheIDT71V3556/58are3.3Vhigh-speed4,718,592-bit(4.5Mega-  
bit) synchronous SRAMS. They are designed to eliminate dead bus  
cycles when turning the bus around between reads and writes, or  
writes and reads. Thus, they have been given the name ZBTTM, or  
Zero Bus Turnaround.  
128K x 36, 256K x 18 memory configurations  
Supports high performance system speed - 200 MHz (x18)  
(3.2 ns Clock-to-Data Access)  
Supports high performance system speed - 166 MHz (x36)  
(3.5 ns Clock-to-Data Access)  
ZBTTM Feature - No dead cycles between write and read  
Address and control signals are applied to the SRAM during one  
clock cycle, and two cycles later the associated data cycle occurs, be  
it read or write.  
cycles  
Internally synchronized output buffer enable eliminates the  
The IDT71V3556/58 contain data I/O, address and control signal  
registers. Output enable is the only asynchronous signal and can be  
used to disable the outputs at any given time.  
need to control OE  
Single R/W (READ/WRITE) control pin  
Positive clock-edge triggered address, data, and control  
A Clock Enable (CEN) pin allows operation of the IDT71V3556/58  
to be suspended as long as necessary. All synchronous inputs are  
ignored when (CEN) is high and the internal device registers will hold  
their previous values.  
There are three chip enable pins (CE1, CE2, CE2) that allow the  
user to deselect the device when desired. If any one of these three are  
not asserted when ADV/LD is low, no new memory operation can be  
initiated. However, any pending data transfers (reads or writes) will be  
completed.Thedatabuswilltri-statetwocyclesafterchipisdeselected  
orawriteisinitiated.  
signal registers for fully pipelined applications  
4-word burst capability (interleaved or linear)  
Individual byte write (BW1 - BW4) control (May tie active)  
Three chip enables for simple depth expansion  
3.3V power supply (±5%), 3.3V I/O Supply (VDDQ)  
Optional- Boundary Scan JTAG Interface (IEEE 1149.1  
compliant)  
Packaged in a JEDEC standard 100-pin plastic thin quad  
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch  
ball grid array (fBGA)  
Pin Description Summary  
A
0
-A17  
Address Inputs  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Output  
Input  
Input  
I/O  
Synchronous  
Synchronous  
Asynchronous  
Synchronous  
Synchronous  
Synchronous  
N/A  
Chip Enables  
CE  
1, CE  
2
, CE  
2
Output Enable  
OE  
R/W  
Read/Write Signal  
Clock Enable  
CEN  
Individual Byte Write Selects  
Clock  
BW  
1, BW  
2
, BW  
3
, BW  
4
CLK  
ADV/LD  
LBO  
TMS  
TDI  
Advance burst address / Load new address  
Linear / Interleaved Burst Order  
Test Mode Select  
Test Data Input  
Synchronous  
Static  
Synchronous  
Synchronous  
N/A  
TCK  
Test Clock  
TDO  
TRST  
ZZ  
Test Data Output  
Synchronous  
Asynchronous  
Synchronous  
Synchronous  
Static  
JTAG Reset (Optional)  
Sleep Mode  
I/O  
0-I/O31, I/OP1-I/OP4  
Data Input / Output  
Core Power, I/O Power  
Ground  
V
V
DD, VDDQ  
SS  
Supply  
Supply  
Static  
5281 tbl 01  
JANUARY 2015  
1
DSC-5281/12  
©
2015 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.  

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