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IDT71V2548S100BQI PDF预览

IDT71V2548S100BQI

更新时间: 2024-11-14 22:25:07
品牌 Logo 应用领域
艾迪悌 - IDT 计数器静态存储器
页数 文件大小 规格书
28页 1005K
描述
128K x 36, 256K x 18 3.3V Synchronous ZBT SRAMs 2.5V I/O, Burst Counter Pipelined Outputs

IDT71V2548S100BQI 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:BGA
包装说明:TBGA, BGA165,11X15,40针数:165
Reach Compliance Code:not_compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.92
最长访问时间:5 ns其他特性:PIPELINED ARCHITECTURE
最大时钟频率 (fCLK):100 MHzI/O 类型:COMMON
JESD-30 代码:R-PBGA-B165JESD-609代码:e0
长度:15 mm内存密度:4718592 bit
内存集成电路类型:ZBT SRAM内存宽度:18
湿度敏感等级:3功能数量:1
端子数量:165字数:262144 words
字数代码:256000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:256KX18输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TBGA
封装等效代码:BGA165,11X15,40封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):225电源:2.5,3.3 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大待机电流:0.045 A最小待机电流:3.14 V
子类别:SRAMs最大压摆率:0.26 mA
最大供电电压 (Vsup):3.465 V最小供电电压 (Vsup):3.135 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn63Pb37)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:20宽度:13 mm

IDT71V2548S100BQI 数据手册

 浏览型号IDT71V2548S100BQI的Datasheet PDF文件第2页浏览型号IDT71V2548S100BQI的Datasheet PDF文件第3页浏览型号IDT71V2548S100BQI的Datasheet PDF文件第4页浏览型号IDT71V2548S100BQI的Datasheet PDF文件第5页浏览型号IDT71V2548S100BQI的Datasheet PDF文件第6页浏览型号IDT71V2548S100BQI的Datasheet PDF文件第7页 
IDT71V2546S  
IDT71V2548S  
IDT71V2546SA  
IDT71V2548SA  
128K x 36, 256K x 18  
3.3V Synchronous ZBT™ SRAMs  
2.5V I/O, Burst Counter  
Pipelined Outputs  
Features  
AddressandcontrolsignalsareappliedtotheSRAMduringoneclock  
cycle,andtwocycleslatertheassociateddatacycleoccurs,beitread  
or write.  
128K x 36, 256K x 18 memory configurations  
Supports high performance system speed - 150 MHz  
(3.8 ns Clock-to-Data Access)  
The IDT71V2546/48 contain data I/O, address and control signal  
registers.Outputenableistheonlyasynchronoussignalandcanbeused  
todisabletheoutputsatanygiventime.  
AClockEnable(CEN)pinallowsoperationoftheIDT71V2546/48to  
besuspendedaslongasnecessary.Allsynchronousinputsareignored  
when(CEN)ishighandtheinternaldeviceregisterswillholdtheirprevious  
values.  
ZBTTM Feature - No dead cycles between write and read  
cycles  
Internally synchronized output buffer enable eliminates the  
need to control OE  
Single R/W (READ/WRITE) control pin  
Positive clock-edge triggered address, data, and control  
signal registers for fully pipelined applications  
4-word burst capability (interleaved or linear)  
Individual byte write (BW1 - BW4) control (May tie active)  
Three chip enables for simple depth expansion  
3.3V power supply (±5%), 2.5V I/O Supply (VDDQ)  
Optional Boundary Scan JTAG Interface (IEEE1149.1  
Therearethreechipenablepins(CE1,CE2,CE2)thatallowtheuser  
to deselect the device when desired. If any one of these three are not  
assertedwhenADV/LDislow,nonewmemoryoperationcanbeinitiated.  
However,anypendingdatatransfers(readsorwrites)willbecompleted.  
Thedatabuswilltri-statetwocyclesafterchipisdeselectedorawriteis  
initiated.  
complaint)  
TheIDT71V2546/48hasanon-chipburstcounter.Intheburstmode,  
theIDT71V2546/48canprovidefourcyclesofdataforasingleaddress  
presentedtotheSRAM.Theorderoftheburstsequenceisdefinedbythe  
LBOinputpin.TheLBOpinselectsbetweenlinearandinterleavedburst  
sequence. The ADV/LD signal is used to load a new external address  
(ADV/LD = LOW) or increment the internal burst counter (ADV/LD =  
HIGH).  
The IDT71V2546/48 SRAMs utilize IDT's latest high-performance  
CMOSprocessandarepackagedinaJEDECstandard14mmx20mm  
100-pinthinplasticquadflatpack(TQFP)aswellasa119ballgridarray  
(BGA) and 165 fine pitch ball grid array (fBGA).  
Packaged in a JEDEC standard 100-pin plastic thin quad  
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine  
pitch ball grid array  
Description  
TheIDT71V2546/48 are3.3Vhigh-speed4,718,592-bit(4.5Mega-  
bit)synchronousSRAMS.Theyaredesignedtoeliminatedeadbuscycles  
when turning the bus around between reads and writes, or writes and  
reads. Thus, they have been given the name ZBT , or Zero Bus  
Turnaround.  
TM  
PinDescriptionSummary  
A0-A17  
Address Inputs  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Output  
Input  
Input  
I/O  
Synchronous  
Synchronous  
Asynchronous  
Synchronous  
Synchronous  
Synchronous  
N/A  
Chip Enables  
CE1, CE2, CE2  
Output Enable  
OE  
R/W  
Read/Write Signal  
Clock Enable  
CEN  
Individual Byte Write Selects  
Clock  
BW1, BW2, BW3, BW4  
CLK  
ADV/LD  
Advance burst address / Load new address  
Linear / Interleaved Burst Order  
Test Mode Select  
Te s t Data Input  
Synchronous  
Static  
LBO  
TMS  
Synchronous  
Synchronous  
N/A  
TDI  
TCK  
Te s t Clo c k  
TDO  
Te s t Data Outp ut  
Synchronous  
Asynchronous  
Synchronous  
Synchronous  
Static  
JTAG Reset (Optional)  
Sleep Mode  
TRST  
ZZ  
I/O0-I/O31, I/OP1-I/OP4  
VDD, VDDQ  
Data Input / Output  
Core Power, I/O Power  
Ground  
Supply  
Supply  
VSS  
Static  
5294 tbl 01  
SEPTEMBER 2004  
1
©2004IntegratedDeviceTechnology,Inc.  
DSC-5294/04  

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