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IDT71V016SA12YI PDF预览

IDT71V016SA12YI

更新时间: 2024-02-13 09:46:13
品牌 Logo 应用领域
艾迪悌 - IDT 存储内存集成电路静态存储器光电二极管
页数 文件大小 规格书
9页 289K
描述
Standard SRAM, 64KX16, 12ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, SOJ-44

IDT71V016SA12YI 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:SOJ包装说明:0.400 INCH, PLASTIC, SOJ-44
针数:44Reach Compliance Code:not_compliant
ECCN代码:3A991.B.2.BHTS代码:8542.32.00.41
风险等级:5.41Is Samacsys:N
最长访问时间:12 nsI/O 类型:COMMON
JESD-30 代码:R-PDSO-J44JESD-609代码:e0
长度:28.575 mm内存密度:1048576 bit
内存集成电路类型:STANDARD SRAM内存宽度:16
湿度敏感等级:3功能数量:1
端子数量:44字数:65536 words
字数代码:64000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:64KX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:SOJ
封装等效代码:SOJ44,.44封装形状:RECTANGULAR
封装形式:SMALL OUTLINE并行/串行:PARALLEL
峰值回流温度(摄氏度):225电源:3.3 V
认证状态:Not Qualified座面最大高度:3.683 mm
最大待机电流:0.01 A最小待机电流:3.15 V
子类别:SRAMs最大压摆率:0.16 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn85Pb15)端子形式:J BEND
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30宽度:10.16 mm
Base Number Matches:1

IDT71V016SA12YI 数据手册

 浏览型号IDT71V016SA12YI的Datasheet PDF文件第2页浏览型号IDT71V016SA12YI的Datasheet PDF文件第3页浏览型号IDT71V016SA12YI的Datasheet PDF文件第4页浏览型号IDT71V016SA12YI的Datasheet PDF文件第6页浏览型号IDT71V016SA12YI的Datasheet PDF文件第7页浏览型号IDT71V016SA12YI的Datasheet PDF文件第8页 
IDT71V016SA, 3.3V CMOS Static RAM  
1 Meg (64K x 16-Bit)  
Commercial and Industrial Temperature Ranges  
AC Electrical Characteristics (VDD = Min. to Max., Commercial and Industrial Temperature Ranges)  
71V016SA10(2)  
71V016SA12  
71V016SA15  
71V016SA20  
Symbol  
Parameter  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit  
READ CYCLE  
____  
____  
____  
____  
t
RC  
AA  
ACS  
Read Cycle Time  
10  
12  
15  
20  
ns  
ns  
ns  
ns  
____  
____  
____  
____  
t
Address Access Time  
10  
12  
15  
20  
____  
____  
____  
____  
t
Chip Select Access Time  
Chip Select Low to Output in Low-Z  
10  
12  
15  
20  
____  
____  
____  
____  
(1)  
CLZ  
4
4
5
5
t
____  
____  
____  
____  
(1)  
Chip Select High to Output in High-Z  
Output Enable Low to Output Valid  
Output Enable Low to Output in Low-Z  
5
6
6
8
ns  
ns  
ns  
t
CHZ  
____  
____  
____  
____  
tOE  
5
6
7
8
____  
____  
____  
____  
(1)  
(1)  
0
0
0
0
t
OLZ  
____  
____  
____  
____  
Output Enable High to Output in High-Z  
Output Hold from Address Change  
Byte Enable Low to Output Valid  
Byte Enable Low to Output in Low-Z  
5
6
6
8
ns  
ns  
ns  
ns  
t
OHZ  
OH  
BE  
t
4
4
4
4
____  
t
5
6
7
8
____  
____  
____  
____  
(1)  
0
0
0
0
tBLZ  
____  
____  
____  
____  
(1)  
Byte Enable High to Output in High-Z  
5
6
6
8
ns  
t
BHZ  
WRITE CYCLE  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
t
WC  
AW  
CW  
BW  
AS  
WR  
WP  
DW  
DH  
Write Cycle Time  
10  
7
12  
8
15  
10  
10  
10  
0
20  
12  
12  
12  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
Address Valid to End of Write  
Chip Select Low to End of Write  
Byte Enable Low to End of Write  
Address Set-up Time  
t
7
8
t
7
8
t
0
0
t
Address Hold from End of Write  
Write Pulse Width  
0
0
0
0
t
7
8
10  
7
12  
9
t
Data Valid to End of Write  
Data Hold Time  
5
6
t
0
0
0
0
____  
____  
____  
____  
(1)  
OW  
Write Enable High to Output in Low-Z  
3
3
3
3
t
____  
____  
____  
____  
(1)  
WHZ  
Write Enable Low to Output in High-Z  
5
6
6
8
ns  
t
NOTES:  
3834 tbl 10  
1. This parameter is guaranteed with the AC Load (Figure 2) by device characterization, but is not production tested.  
2. 0°C to +70°C temperature range only.  
Timing Waveform of Read Cycle No. 1(1,2,3)  
tRC  
ADDRESS  
tAA  
t
OH  
tOH  
DATAOUT VALID  
DATAOUT  
PREVIOUS DATAOUT VALID  
NOTES:  
1. WE is HIGH for Read Cycle.  
3834 drw 06  
2. Deviceiscontinuouslyselected,CSisLOW.  
3. OE, BHE, and BLE are LOW.  
6.42  
5

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